Achievements in Ultrashort Laser Matter Interaction


Fig. A: waveguide on fused silica

(100mm below the surface)


Fig. B: micro hole (50:1 with 20mm dia)

Fig. C: thin film scribing on a solar cell panel

Research on Ultrashort Laser-Material Interaction

The goal of this project area is to establish a scientific understanding of ultrashort laser-matter interaction and develop novel applications using ultrashort pulsed lasers.  Specific objectives of the research include:

  • Establishing predictive models for ultrashort laser-matter interaction based on:
    • atomistic modeling
    • hydrodynamic modeling
    • two-temperature models
    • multi-scale, multi-physics modeling
  • Studying the plasma dynamics and evolution during ultrashort laser material interaction
  • Developing experimental measurement capabilities of plasma
  • Develop novel micro/nano fabrication capabilities using ultrashort lasers including;
    • fabrication of waveguides and micro-channels on fused silica
    • micro machining capabilities including high aspect hole drilling
    • micro machining of soft transparent biomaterials
    • fabrication of micro/nano devices using two photon polymerization
    • solar cell thin film scribing
    • creation of nano-size surface textures for solar cells and hydrophobic surfaces for applications to microfluidic devices and micro heat exchangers

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Research Plan:

The study is based on the simultaneous experimental and numerical investigations of of ultrashort laser material interaction. The experimental investigations are being carried out using a Spectra Physics femtosecond laser (Spectra Physics, Spitfire Pro: 1mJ, 800nm, 1 kHz, 100 fs) and a Lumera picosecond laser (2W, 500kHz, 10 ps, 532 nm, 1064 nm).   Various beam delivery mechanisms and diagnostics instruments are used with these set-ups.   Modeling efforts include an atomistic modeling approach based on molecular dynamics-Monte Carlo method, multi-physics  hydrodynamic models for prediction of material ablation and plasma evolution, and two-temperature models to predict ablation depth.  These models are supplemented by the in-house developed Quotidian Equations of State (QEOS) for calculation of requisite properties.  At the same time, various novel applications utilizing ultrafast lasers are being explored.

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Research Progress:

  • Successful modeling of ablation depth using a two-temperature model for various materials including metals, semi-conductors and insulators.
  • Development of a molecular dynamics (MD) + Monte Carlo (MC) simulation model for energy transport during the ultrashort metal interaction (Fig. 2).
  • Early plasma dynamics prediction using an extended MD technique.
  • Development of a comprehensive 2D hydrodynamic model for ultrashort laser matter interaction.
  • Measurement of plasma evolution during the femtosecond laser ablation using fluorescence spectroscopy and shadowgraph techniques (Fig. 1).
  • Successful high aspect ratio micro hole drilling (50:1) (Fig. B).
  • Fabrication of waveguides and micro channels on SiO2 using the femtosecond laser (Fig. A).
  • Microchannel formation on soft gel bio materials.
  • Fabrication of nanostructures such as photonic crystals by 2PP (see Fig. 3 and 4).
  • High speed pricise microchannel scribing (Fig. C).
  • Creation of nano-sized laser-induced periodic surface structures for absorption improvement of light energy for silicon and thin film solar cells.

Related publications

Fig. 1:  Measured plasma evolution during femtosecond laser ablation with ps resolution using a pump-probe beam method


Fig. 2: MD-MC simulation of laser ablation


Fig. 3:  Photonic crystal structure with submicron resolution made by TPP


Fig. 4:  Armadillo shape with 10x10x20 micron envelop by two photon polymerization

  % All the figures may be copyrighted.   Use of these figures require written permission.

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A femtosecond laser set-up


Picosecond laser set-up


National Science Foundation
Air Force, Navy
Indiana 21st Century Research and Technology
Industrial Members


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Copyright 2001 Dr. Y.C. Shin
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