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    Sungwook Moon - Engineer, Samsung Korea Moon

    Education

    B.S. - Kwangwoon University, 1995
    M.S. - Kwangwoon University, 1997
    Ph.D. - Purdue University, 2010

    Research

    Anisotropic conductive adhesive to create small, vertical RF interconnects. Tunable evanescent mode cavity resonators.

     

    Publications

    Journal Articles

    [1] S. Moon and W. J. Chappell, "Novel Three-Dimensional Packaging Approaches Using Magnetically Aligned Anisotropic Adhesive for Microwave Applications," IEEE Trans. Microwave Theory and Techniques, Accepted.
    [2] S. Moon, H. H. Sigmarsson, H. Joshi, and W. J. Chappell, “Substrate Integrated Evanescent-mode cavity filter with a 3.5 to 1 tuning ratio,” IEEE Microwave and Wireless Component Letters, vol. 20, no. 8, pp. 450-452, Aug. 2010.
    [3] H. Joshi, H. H. Sigmarsson, S. Moon, D. Peroulis, and W. J. Chappell, “High Q Fully Reconfigurable Tunable Band Pass Filters,” IEEE Trans. Microwave. Theory Tech., vol. 57, no. 12, pp. 3525-3532, Dec. 2009.

    [4] S. Moon, H. H. Sigmarsson, Y. Huang, T. Bruemmer, S. K. Khanna, and W. Chappell, “Magnetically Aligned Anisotropic Conductive Adhesive for Microwave Applications”, IEEE Trans. Microwave. Theory Tech., vol. 56, no. 12, pp. 2942-2949, Dec. 2008.

    [5] E. Y. Chow, C.-L. Yang, A. Chlebowski, S. Moon, W. J. Chappell, and Pedro P. Irazoqui, “Implantable Wireless Telemetry Boards for in-vivo Transocular Transmission”, IEEE Trans. Microwave. Theory Tech.,vol. 56, no. 12, pp. 3200-3208, Dec. 2008.

    [6] S. Moon, S. Han, J. Choi, S. Shin, M. Margalit, E. Avni, and G. Rogovsky, “Packaging for a FP-LD Hybrid Transceiver Using Filter-Integrated PLC Platform with PD Insertion Trench,” Microwave & optical technology letters, Wiley inter-Science journal, vol. 48, no.3, pp. 489-491, Mar. 2006.
    [7] S.Moon, S. Han, J. Choi, S. Shin, G. Ryu, S. Park, S. Song, M. Margalit, E. Avni, and G. Rogovsky, “Hybrid packaging for a 1.25Gbps bidirectional transceiver using filter-integrated PLC platform,”Microwave & optical technology letters, Wiley inter-Science journal, vol. 47, no.1, pp. 34-36, Oct. 2005.
    [8] S. Moon and J. Han, “Packaging of CWDM bidirectional transceiver using robust tuning scheme of thin-film filter”, IEICE (The Institute of Electronics, Information and Communication Engineers) Electron. Express, vol. 2, no. 21, pp.536-541, 2005.
    [9] J. Han and S. Moon, “Evaluation of EMC up to 1GHz for 155Mb/s optical transceiver modules”, IEICE (The Institute of Electronics, Information and Communication Engineers) Electron. Express, vol. 2, no. 19, pp.506-511, 2005.
    [5]     S. Moon, H. H. Sigmarsson, H. Joshi, and W. J. Chappell, “Substrate Integrated Evanescent-Mode Cavity Filter With a 3.5 to 1 Tuning Ratio,” IEEE Microwave and Wireless Components Letters, vol. 20, no. 8, pp. 450-452, Aug. 2010.

     

    Conference Papers

    [1] S. Moon and W. J. Chappell, "Adjustable Dielectric Using Magnetically Aligned Conductive Particles for Microwave Applications," IEEE MTT-S Int. Microwave Symp., Anaheim, USA, 23-28 May 2010, Accepted.
    [2] S. Moon and W. Chappell, "Column Distribution Analysis and RF Characterization of High-Density Vertical Interconnections Created by Magnetically Aligned Anisotropic Conductive Adhesive," Proceedings of International Symposium on Microelectronics, International Microelectronics and Packaging Society (IMAPS), San Jose, USA, Nov. 2009, pp. 705-710.
    [3] H. H. Sigmasson, H. Joshi, S. Moon, D. Peroulis, and W. Chappell, "Substrate Integration of Widely Tunable Bandpass Filters," Proceedings of International Symposium on Microelectronics, International Microelectronics and Packaging Society (IMAPS), San Jose, USA, Nov. 2009, pp. 711-716.

    [4] S. Moon, S. K. Khanna, and W. J. Chappell, "Multilayer Silicon RF System-in-Package Technique Using Magnetically Aligned Anisotropic Conductive Adhesive," IEEE MTT-S Int. Microwave Symp., Boston, USA, 7-12 June 2009, pp 797-800.

    [5] H. Joshi, H. H. Sigmarsson, S. Moon, D. Peroulis, and W. J. Chappell, "High Q Narrow-Band Tunable Filters with Controllable Bandwidth,"IEEE MTT-S Int. Microwave Symp., Boston, USA, 7-12 June 2009, pp 629-632.
    [6] H. Joshi, H. H. Sigmarsson, S. Moon, D. Peroulis, and W. J. Chappell “Tunable High Q Narrow-Band Triplexer,” IEEE MTT-S Int. Microwave Symp., Boston, USA, 7-12 June 2009, pp 1477-1480.
    [7] H. H. Sigmarsson, A. J. Christianson, H. Joshi, S. Moon, D. Peroulis, and W. J. Chappell, "In-Situ Control of Tunable Evanescent-Mode Cavity Filters Using Differential Mode Monitoring,"IEEE MTT-S Int. Microwave Symp., Boston, USA,7-12 June 2009, pp 633-636.
    [8] S. Moon, T. Bruemmer, S. K. Khanna, and W. Chappell, "High-Frequency Characterizaiton of Self-Aligned Z-axis Interconnects on Silicon substrates" Proceedings of Union Radio Scientifique Internationale (URSI), Chicago, USA, Aug. 2008.
    [9] S. Moon, and W. Chappell, "Vertical Interconnects using Magnetically Aligned Anisotropic Conductive Adhesive for RF packaging" Proceedings of International Symposium on Microelectronics, International Microelectronics and Packaging Society (IMAPS), Providence, USA, Nov.  2008.
    [10] S. Moon and J. Han, “Packaging Consideration for a Novel CWDM Bidirectional Transceiver Configured with TO-Packaged LD, PD and Thin Film Filter,” IEEE LEOS 2005, WX3, Sydney Australia, Oct. 23~27, 2005.
    [11] S. Moon, S. Han, J. Choi, S. Shin, M. Margalit, and G. Rogovsky., “Fabrication of a 1.25Gbps hybrid transceiver using passive alignment,”CLEO-PR 2005, CWK1-5, Tokyo, Japan, July 11~15, 2005.
    [12] S. Moon, S. Han, J. Choi, S. Shin, G. Ryu, S. Park, S. Song, M. Margalit, E. Avni, and G. Rogovsky, “Packaging for 1.25Gbps hybrid transceiver using filter integrated PLC platform,” 10th Optoelectronics & Communications Conference (OECC 2005), 6F4-5, Seoul, Korea July 1~5, 2005.
    [13] S. Moon, S. Han, J. Choi, s. Shin, G. Ryu, S. Park, S. Song, M. Margalit, E. Avni, and G. Rogovsky, G., “Packaging of filter-integrated hybrid transceiver for subscriber access network,”4th IEEE/LEOS WORKSHOP ON FIBRES AND OPTICAL PASSIVE COMPONENTS (WFOPC), CWK1-5, Palemo, Italy June 22~24, 2005.
     

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