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    Jimin Maeng - Graduate Research Assitant

    Education

    B.S. - Hanyang University, 2003
    M.S. - Seoul National University, 2008
    Ph.D. (Candidate) - Purdue University, Current

    Research

    Polymer-based advanced 3D packaging for biomedical implantable devices.

     

     

    Publications

    Journal Articles

    [1] J. Maeng, B. Kim, D. Ha, and W. J. Chappell, “Parylene Interposer as Thin Flexible 3D Packaging Enabler for Wireless Applications, ” IEEE Trans. Microwave Theory & Tech., vol. 59, no. 12, pp. 3410-3418, December 2011.

    [2] C. Yoo, J. Maeng, N. Cheon, S. Song, and K. Seo, “W-Band Compact Bandpass Filters on Thin-Film Substrate,” Microwave and Optical Technol. Lett., vol. 52, no. 3, pp. 750-753, March 2010.

    [3] S. Song, Y. Kim, J. Maeng, H. Lee, Y. Kwon, and K. Seo, “A Millimeter-Wave System-on-Package Technology Using a Thin-Film Substrate with a Flip-Chip Interconnection,” IEEE Trans. Adv. Packag., vol. 32, no. 1, pp. 101-108, February 2009.

    [4] J. Maeng, S. Song, N. Jeon, C. Yoo, H. Lee, and K. Seo, “Embedded Decoupling Capacitors up to 80 nF on MCM-D with Quasi-3D MIM Structure,” Jap. J. Appl. Phys., vol. 47, no. 4, pp. 2535-2537, April 2008.

    [5] C. Yoo, J. Maeng, S. Song, K. Seo, and W. Lee, “A Compact Ultrawide Bandpass Filter on Thin-Film Substrate,” IEICE Trans. Electron., vol. 90-C, no. 12, pp. 2232-2236, December 2007.

    [6] D. Kim, J. Maeng, S. Kim, J. Her, H. Kim, and K. Seo, “Innovative Low Damage Silicon Nitride Passivation of 100nm In0.45AlAs/In0.4GaAs Metamorphic HEMTs with Remote ICPCVD,” ECS Trans. 6, 577 (2007).

     

    Conference Papers

    [1] J. Maeng, B. Kim, D. Ha, and W. J. Chappell, “Thin-Film Multilayer Parylene Interposer for High-Density 3D Packaging with Embedded Capacitors,” IEEE MTT-S Int. Microwave Symp. Digest (IMS2011), Baltimore, MD, USA, June 2011, pp. 1-4. - This work won honorable mention in the Student Paper Competition.

    [2] J. Maeng, N. Jeon, S. Song, and K. Seo, “W-Band Cross-Coupled Filters and a Duplexer on a Thin-Film Substrate for Low-Cost Front-End Integration,” IEEE Electron. Compon. Technol. Conf. (ECTC2009), San Diego, CA, USA, May 2009, pp. 1594-1598.

    [3] J. Maeng, S. Song, C. Yoo, H. Lee, and K. Seo, “Integration of MIM Capacitors on BCB with Thin-Film MCM-D Technology,” Int. Conf. Solid State Devices and Materials (SSDM2007), Ibaraki, Japan, September 2007, pp. 384-385.
    [4] C. Yoo, J. Maeng, S. Song, H. Lee, W. Lee, N. Kang, and K. Seo, “A Compact Balanced Filter on Thin Film Substrate for mm Wave Application,” Int. Conf. Solid State Devices and Materials (SSDM2007), Ibaraki, Japan, September 2007, pp. 500-501.
    [5]S. Song, J. Maeng, H. Lee, and K. Seo, “High-Performance Millimeter-Wave SOP Technology with Flip-Chip Integration,” IEEE Electron. Compon. Technol. Conf. (ECTC2007), Reno, NV, USA, May 2007, pp. 1007-1013.
     

     

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