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    Pick and Place
    Fine Tech Pick and Place Assembly Station
    This station allows precise alignment of parts onto substrates. The part is attached to the head using a vaccuum while the substrate is fastened to the stage below. The video camera monitors both the part head and substrate, superimposing the images on the monitor. After alignment is achieved the head with the part is lowered to the substrate and can be attached with solder, epoxy, ACA, or another substance. The heads are heated and there is a heater under the substrate to reflow solder.
     



     

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