This class 4, 1W laser is used for the ablation of thin films. Its six micrometer spot size enables the fabrication of small precisely defined isolation gaps and via holes. The laser is controlled by a two axis scan head with a working area of 120x120mm. The 23 cm working distance also facilitates the isolation at high aspect ratios on 3D surfaces. It has been used in the isolation of ion trap chemical sensors, via hole drilling in LCP, LTCC, and silicon, and patterning of miniature implantable antennas. This laser ablation system provides the rapid prototyping capability for circuits smaller than can be patterned on the milling machine.
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