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    Project Abstract

    Fig. 1. Multi-layer toroidal inductors created in LTCC, [1], [2].

    In advanced packaging, Professor Chappell's research group is attempting to expand the role of vertical integration in high frequency circuits.
    He has garnered industrial attention through the integration of ceramic multilayer circuits with less traditional integrated circuit techniques for the development of commercialized vertically integrated circuits. Through earlier work in two DARPA-sponsored projects which focused on vertical integration of packaging for high frequency communications (satellite and terrestrial), he was able to establish an advanced packaging laboratory garnering large equipment donations from industry to create a Low Temperature Cofired Ceramic (LTCC)/ organic board packaging laboratory. Since then, this laboratory has been where much of the design and fabrication for our research group occurs.

    Fig. 2. First lumped-elements-based absorptive bandstop filter on LTCC [3].


    The advanced packaging laboratory has a wide range of tools available for use. This includes machines for LTCC assembly such as screen printers, a precision punch, inspection stations and several ovens which form a fully capable LTCC product development area. The lab also contains a polymer deposition system (Parylene CVD) that provides conformal coatings of Parylene film, and a stereolithography machine which is used to form arbitrary 3-dimensional shapes out of polymer. There is also a milling machine that can be used to fabricate large scale planar circuits as well as patch antennas and similar devices. There are also several computers in the lab that are used for simulations.

    Fig. 3.  Flexible electronics on multilayer Parylene interposer [4], [5].


    The work in this laboratory is supplementary to the work done in the Birck Nanotechnology Center that allows for full system level solutions at a packaging level supporting the more traditional wafer-based work found in most solid state/MEMS laboratories. We also have collaboration with local design and assembly companies and utilize it when industry experience in product design and prototyping is required. This lab has provided the group with a unique area in high frequency circuits and will be the basis for our research for years to come in the high frequency circuit arena.

    One area of interest within the advanced packaging laboratory has been the demonstration of multilayer laser-based processing for micro and millimeter wave circuits. Vertically integrated circuits with hundreds of rapidly deposited polymer layers allow for novel three-dimensional designs never before demonstrated. Another area of interest has been the demonstration of flexible 3D packaging technology based on the novel use of polymer materials such as Parylene and Liquid Crystal Polymer (LCP). This technology aims to enable the vertical integration of high-frequency wireless-powered electronic systems on a multilayer interposer in an ultrathin and flexible form factor. Our capability of flexible 3D packaging has also been effectively used in biomedical projects.


    Currently Involved Students

    Jimin Maeng
    Tsung-Chieh Lee
    Dohyuk Ha
    ByungGuk Kim
    Eric Hoppenjans


    Recent Publications

    [1] E. E. Hoppenjans, W. J. Chappell “High Value Passive Component Integration in LTCC Technology” IEEE MTT-S International Microwave Symposium Digest (IMS2007), June 2007, pp. 1913-1916.

    [2] E. E. Hoppenjans, W. J. Chappell, "The Use of High Q Toroid Inductors for LTCC Integrated Tunable VHF Filters," IEEE MTT-S International Microwave Symposium Digest, June 2009, pp. 905-908.

    [3] J. Lee, T.-C. Lee, and W. J. Chappell, "Lumped Element Realization of Absorptive Bandstop Filter with Anomalously High Spectral Isolation," IEEE Transactions on Microwave Theory and Techniques, accepted for publication.

    [4] J. Maeng, B. Kim, D. Ha, and W. J. Chappell, “Thin-Film Multilayer Parylene Interposer for High-Density 3D Packaging with Embedded Capacitors,” IEEE MTT-S International Microwave Symposium Digest (IMS2011), June 2011, pp. 1-4.

    [5] J. Maeng, B. Kim, D. Ha, and W. J. Chappell, “Parylene Interposer as Thin Flexible 3D Packaging Enabler for Wireless Applications, ” IEEE Transactions on Microwave Theory and Techniques, vol. 59, no. 12, pp. 3410-3418, December 2011.


    The laboratory’s LTCC fabrication capabilities include:


    Click here for a downloadable overview of our Advanced Packaging capabilities.


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