Affiliates

The Center for Heterogeneous Integration Research on Packaging (CHIRP) is co-directed by Ganesh Subbarayan of Purdue and Bahgat Sammakia of SUNY Binghamton. CHIRP's mission is to enable the building of future Systems-in-Package through Heterogeneous Integration. The areas of CHIRP research focus include design enablement, global interconnects, power delivery, thermal management, modeling, metrology, and reliability that together optimally address the power, performance, area and cost metrics of systems. CHIRP also works to educate engineers who can design and build heterogeneously integrated systems. The center was established in 2019 with support from ARM, Intel, IBM, Mediatek, NXP, Samsung, and Texas Instruments, and has since funded over $6M in projects. CHIRP engages nearly 20 investigators from Purdue and SUNY Binghamton. The details on impact and industry engagement of CHIRP are at https://www.src.org/program/grc/chirp/.

The Cooling Technologies Research Center (CTRC) is a graduated National Science Foundation Industry/University Cooperative Research Center and addresses pre-competitive, longer-term research and development issues in the area of high-performance heat removal from compact spaces.

The objective of Rapid-HI Design Institute is to develop rapid and large-scale multiphysics modeling and analysis and multiphysics informed physical design to automate the HI design from intent to fabrication. We will fuse machine intelligence and domain expertise for significantly accelerated modeling, analysis, and optimization. This collaborative research effort will result in a rapid hardware compiler of HI systems enabled by multiphysics (electrical, thermal, and mechanical) design automation and it will be used to transform current manual, partially-automated, and non-optimal practice of package and system design to fully automated and optimized design. The HI hardware compiler will be made open source, contributing to the design ecosystem.

The Defense Electronics Consortium (DEC), to be established and managed by the U.S. Partnership for Assured Electronics (USPAE), is designed to address the defense risks created by the contraction of the U.S. electronics manufacturing sector over the last 20 years.