News/Events

UT’s Texas Institute for Electronics Awarded $840M to Build a DOD Microelectronics Manufacturing Center, Advance U.S. Semiconductor Industry

Seeking to ensure America’s national security and global military leadership, the Defense Advanced Research Project Agency (DARPA) has selected the Texas Institute for Electronics (TIE) at The University of Texas at Austin to develop the next generation of high-performing semiconductor microsystems for the Department of Defense.

Deep Dive Series: In-depth discussion from an expert on subjects that require an increased focus in the next edition of the Decadal Plan and MAPT Roadmap

Ganesh Subbarayan, James G. Dwyer Professor of Mechanical Engineering, gave two deep dive talks on digital twins as part of the Microelectronics and Advanced Packaging Technologies Roadmap Deep Dive Series. These talks were given on June 7, 2024 and August 9, 2024.

Ganesh Subbarayan Receives Richard Chu Award for Excellence in Thermal and Thermo-Mechanical Management of Electronics

The Richard Chu Award for Excellence in Thermal and Thermo-Mechanical Management of Electronics, formerly known as the ITherm Achievement Award was instituted in 1996 and presented in recognition of significant contributions made in thermal and thermo-mechanical aspects of electronics devices and systems.

SkyWater Technology chooses Purdue for $1.8B semiconductor fabrication facility, to create 750 jobs in 5 years

SkyWater Technology announced plans to open a $1.8 billion state-of-the-art semiconductor manufacturing facility in Discovery Park District at Purdue University, marking a huge step forward for the American semiconductor industry, Purdue’s thriving innovation district and the university’s continued emergence as one of the principal drivers of the Indiana economy.

SK hynix announces semiconductor advanced packaging investment in Purdue Research Park

SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion to build an advanced packaging fabrication and R&D facility for AI products in the Purdue Research Park.

Purdue’s new institute for advanced system integration and packaging honors Boilermaker and innovative visionary in semiconductors

Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus.

SRC Releases Roadmap to Guide CHIPS R&D

Materials Engineering and Environmental and Ecological Engineering's Carol Handwerker was vice chair of the Workforce Development chapter and Mechanical Engineering's Ganesh Subbarayan was vice chair of the Advanced Packaging and Heterogeneous Integration chapter for the first industry-wide 3D semiconductor roadmap to guide the microelectronics revolution.

New institute accelerates future of microelectronic system integration, advanced packaging

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing and building of microelectronic systems.

International Workshop for Advanced System Integration and Packaging

Organized by Purdue University's Institute for Advanced System Integration and Packaging (ASIP) in partnership with ARI, host of the Si Crossroads ME Commons Hub, Osaka University and imec USA.

SRC Microelectronics and Advanced Packaging Technologies Roadmap

Purdue faculty served as vice-chairs in leading the writing of chapters on workforce development (Carol Handwerker) and Advanced Packaging (Ganesh Subbarayan). The roadmap will be publicly released on October 20, 2023.

Purdue signs a series of landmark agreements for semiconductors

Purdue University continues to be the world leader in creating vital partnerships in semiconductors. Appearing at the recent G7 Summit, President Mung Chiang has announced a string of international agreements with Japan, Greece, India, Belgium, and Taiwan.

Purdue excels at ITherm conference

Purdue was well-represented at ITherm 2023, winning three paper awards and four poster awards. The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems was held in Orlando, FL in June 2023.

Creating the computer chips of the future

Ganesh Subbarayan is the James G. Dwyer professor of mechanical engineering at Purdue University. In this video, he explains what advanced chip packaging is and how it will keep advancements in this field powerful and cost effective.

Ganesh Subbarayan wins SRC Technical Excellence Award

Ganesh Subbarayan has been recognized by the Semiconductor Research Corporation (SRC) with its 2022 Technical Excellence Award. He was cited as being the "top researcher for the comprehensiveness and rigor of his approach. He has combined the depth of Fracture & Continuum Mechanics with innovative computational and experimental techniques to describe solder material and stress evolution under different processing and reliability conditions and in the presence of multiple flaws. He co-leads the CHIRP Center to achieve significantly enhanced functionality by heterogeneous packaging of advanced microchips."

Secretaries of State and Commerce visit Purdue to discuss building a US microelectronics ecosystem

U.S. Secretary of State Antony J. Blinken and Secretary of Commerce Gina Raimondo visited Purdue University to tour research facilities and meet students as they embark on their mission to bolster the U.S. semiconductor industry. Sen. Todd Young (R-Ind.) and Indiana Gov. Eric J. Holcomb joined Blinken and Raimondo on a tour of Purdue’s Birck Nanotechnology Center, highlighting the leading-edge research and workforce development efforts at Purdue that can help the United States restore domestic semiconductor manufacturing and competitiveness abroad.

Purdue partners with leading global chipmaker on Midwest's first semiconductor design center

Purdue University’s College of Engineering is partnering with MediaTek Inc., a leading global fabless chipmaker, to open the Midwest’s first semiconductor chip design center, to be housed on Purdue’s campus.

Purdue launches nation’s first comprehensive Semiconductor Degrees Program

Purdue University will become the first in the country to launch a comprehensive set of innovative, interdisciplinary degrees and credentials in semiconductors and microelectronics.

Ganesh Subbarayan gives Distinguished Lecture at Georgia Tech's 3D Systems Packaging Center

Ganesh Subbarayan, co-director of Purdue's Center for Heterogenous Integration Research in Packaging (CHIRP), gave a Distinguished Lecture at Georgia Tech's 3D Systems Packaging Research Center, entitled "Reliability Assessment for Heterogeneously Integrated Package."

SRC Selected by NIST's Advanced Manufacturing Office to Define the Future of Microelectronics and Advanced Packaging Technology (MAPT)

Semiconductor Research Corporation (SRC), a world-renowned high technology research consortium, announced today that it has been selected by the U.S. Department of Commerce’s National Institute of Standards and Technology’s (NIST) Advanced Manufacturing Office to define the future technology goals of the microelectronics and advanced packaging technology (MAPT) industry.

NIST Awards Funding to Strengthen Advanced Manufacturing for Microelectronics, Digital and Biomanufacturing

The U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) has awarded a total of $1.2 million to four organizations to develop technology roadmaps aimed at strengthening U.S. manufacturing and innovation across industries.

Purdue and SRC partner in pursuit of advanced microelectronics, semiconductor workforce

Purdue University and the Semiconductor Research Corporation (SRC) are connecting academic researchers and industrial practitioners together, providing the tools needed for revolutionary research in packaging for more powerful microchips.

SRC President visits Purdue

Semiconductor Research Corporation (SRC) President and CEO Todd Younkin met with Purdue President Mitch Daniels on November 5.

WATCH: Microelectronics and Advanced Packaging Workforce Development Workshop

Purdue University hosted a workshop on the challenges and opportunities of workforce development for microelectronics and advanced packaging. Participants included representatives from Microsoft, AMD, US Department of Commerce, NSF, SRC, and several universities. Watch the whole seminar online!

Purdue Faculty Invited to Present to the U.S. Department of Commerce Emerging Technologies Technical Advisory Committee

The Committee advises the Office of the Assistant Secretary for Export Administration on technical questions that affect the level of export controls applicable to information systems equipment and technology.

New center to bring higher-performance computing at lower cost

The cost of computing has been steadily decreasing as companies pack more components and functions onto a single chip, for applications ranging from smartphones to large mainframe computers. Through a new center funded by the Semiconductor Research Corporation (SRC), Purdue University and Binghamton University will improve how to "package," or protect and supply power to, chips of various functions integrated together.