News/Events

Purdue’s new institute for advanced system integration and packaging honors Boilermaker and innovative visionary in semiconductors

Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus.

SRC Releases Roadmap to Guide CHIPS R&D

Materials Engineering and Environmental and Ecological Engineering's Carol Handwerker was vice chair of the Workforce Development chapter and Mechanical Engineering's Ganesh Subbarayan was vice chair of the Advanced Packaging and Heterogeneous Integration chapter for the first industry-wide 3D semiconductor roadmap to guide the microelectronics revolution.

International Workshop for Advanced System Integration and Packaging

Organized by Purdue University's Institute for Advanced System Integration and Packaging (ASIP) in partnership with ARI, host of the Si Crossroads ME Commons Hub, Osaka University and imec USA.

SRC Microelectronics and Advanced Packaging Technologies Roadmap

Purdue faculty served as vice-chairs in leading the writing of chapters on workforce development (Carol Handwerker) and Advanced Packaging (Ganesh Subbarayan). The roadmap will be publicly released on October 20, 2023.