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Purdue Expert: Chip Packaging

Purdue University News
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569 views 2 years ago #purdueuniversity #purdue #purduenews
Media is welcome to use this video for TV, radio or podcasts or pull quotes for print articles. Ganesh (guh-NESH) Subbarayan (sue-buh-RYE-in) is the James G. Dwyer professor of mechanical engineering at Purdue University. In this video, he explains what advanced chip packaging is and how it will keep advancements in this field powerful and cost effective. Subbarayan says that chip packaging provides functionality of a system when you connect multiple chips together. Advanced packaging is when multiple smaller chips, or ā€œchipletsā€ come together and function as a single chip. In the past, chips were able to be produced every two years with double the amount of transistors while still maintaining their size and cost. Subbarayan says that this concept, known as Mooreā€™s Law, no longer holds true. Advanced packaging is a solution to this problem, allowing multiple chips to act as a single chip to achieve the desired performance, power, and cost. Purdue is working with some of the largest semiconductor companies in the world to advance the chip packaging field. #purdue #purduenews #purdueuniversity ...more
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Purdue Expert: Chip Packaging
7Likes
569Views
2023Apr 3
Media is welcome to use this video for TV, radio or podcasts or pull quotes for print articles. Ganesh (guh-NESH) Subbarayan (sue-buh-RYE-in) is the James G. Dwyer professor of mechanical engineering at Purdue University. In this video, he explains what advanced chip packaging is and how it will keep advancements in this field powerful and cost effective. Subbarayan says that chip packaging provides functionality of a system when you connect multiple chips together. Advanced packaging is when multiple smaller chips, or ā€œchipletsā€ come together and function as a single chip. In the past, chips were able to be produced every two years with double the amount of transistors while still maintaining their size and cost. Subbarayan says that this concept, known as Mooreā€™s Law, no longer holds true. Advanced packaging is a solution to this problem, allowing multiple chips to act as a single chip to achieve the desired performance, power, and cost. Purdue is working with some of the largest semiconductor companies in the world to advance the chip packaging field. #purdue #purduenews #purdueuniversity

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Purdue University News

2.76K subscribers