Daniel Valencia

Daniel Valencia's Biography

Daniel Valencia received his bachelors in Physics from the Universidad Nacional de Colombia in Bogota in 2008. There he did research in biophysics, modelling how thermodynamics affect the topology of a membrane.

He then went on to complete his M.Sc. at the University of Puerto Rico in Mayaguez, where he worked with Professor Junqiang Lu on four different projects as follows:

  1. The study of transport properties of graphene junctions in collaboration with the professor Feng Lui of Utah University. A manuscript of this work is currently in preparation, and was presented orally in the annual APS meeting in March 2012.
  2. The numerical study of annular wave packages at Dirac points (J. Chem. Phys. 135, 224707-(2011)) in collaboration with the postdoctoral research fellow Ji Lu.
  3. The electronic properties and work functions of metallic hexaboride rods and slabs with a coil. This project is an extensive collaboration between the Mayaguez research group and the professors Sabirianov and Cheung and their respective groups in Nebraska University. The manuscript is now in revision.
  4. The modeling of quantum transport for high-K gate oxides in search of materials that present less liquid current in MOSFET nanotransistors.

In the fall of 2012, Daniel began his PhD in Electrical Engineering at Purdue University and joined the Klimeck research group. He is currently working on the following projects:

  1. "ab-inition" parametrization for orthogonal and Non-orthogonal tight binding basis
  2. Electronic transport implementation for Non-orthogonal tight binding basis
  3. Interface modeling by tight binding models such as Extended Huckel
  4. Validation of a Non-orthogonal Basis in N5
  5. Validation of EH for multiple materials
  6. Performance of EH Hamiltonian
  7. Modeling Silicon dioxide with EH
  8. Modeling Amorphous oxide with EH
  9. Benchmark other oxides
  10. Transport on Oxide-Semiconductor Interface
  11. Transferability of EH Parameters for Copper
  12. Copper Interconnections
  13. Self Consistent Calculation with EH