Is it possible to describe single grain boundaries (GB) for copper interconnections with the EH model?
Approach:
The transmission spectrum was calculated by NEGF method for an orthogonal (TB) and non-orthogonal (EH) tight binding method and benchmarked against DFT.
Results/Impact:
Resistance calculations for single grain shows a difference smaller than 6% compared to results obtained by DFT and much smaller than obtained by TB.
