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Surface Cleaning & Activation
Plasma Etch PE-100
The Plasma Etch PE-100 is a benchtop plasma system that enables controlled surface modification through plasma exposure, allowing removal of contaminants and activation of material surfaces. This process improves adhesion and bonding prior to coating, deposition, or joining operations.
- Process Plasma surface treatment
- Functions Cleaning and surface activation
- Chamber 12 × 14.5 × 12 in, three stacked horizontal electrode shelves (standard configuration)
- RF Power 300 W, 100 kHz, continuously variable (standard configuration)
Unique Capabilities
- Plasma cleaning and activationControlled plasma exposure modifies the outermost surface layer without affecting bulk material properties.
- Oxide and organic contaminant removalStrips thin oxides and organic residues that interfere with bonding and deposition.
- Improved surface energy and adhesionRaises surface energy before coating, deposition, or joining, improving adhesion and bond quality.
Manufacturer Information
Publications Using This Machine
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