News

Purdue University continues to be the world leader in creating vital partnerships in semiconductors. Appearing at the recent G7 Summit, President Mung Chiang has announced a string of international agreements with Japan, Greece, India, Belgium, and Taiwan.

Purdue was well-represented at ITherm 2023, winning three paper awards and four poster awards. The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems was held in Orlando, FL in June 2023.

Ganesh Subbarayan is the James G. Dwyer professor of mechanical engineering at Purdue University. In this video, he explains what advanced chip packaging is and how it will keep advancements in this field powerful and cost effective.

Ganesh Subbarayan has been recognized by the Semiconductor Research Corporation (SRC) with its 2022 Technical Excellence Award. He was cited as being the "top researcher for the comprehensiveness and rigor of his approach. He has combined the depth of Fracture & Continuum Mechanics with innovative computational and experimental techniques to describe solder material and stress evolution under different processing and reliability conditions and in the presence of multiple flaws. He co-leads the CHIRP Center to achieve significantly enhanced functionality by heterogeneous packaging of advanced microchips."

U.S. Secretary of State Antony J. Blinken and Secretary of Commerce Gina Raimondo visited Purdue University to tour research facilities and meet students as they embark on their mission to bolster the U.S. semiconductor industry. Sen. Todd Young (R-Ind.) and Indiana Gov. Eric J. Holcomb joined Blinken and Raimondo on a tour of Purdue’s Birck Nanotechnology Center, highlighting the leading-edge research and workforce development efforts at Purdue that can help the United States restore domestic semiconductor manufacturing and competitiveness abroad.

Purdue University’s College of Engineering is partnering with MediaTek Inc., a leading global fabless chipmaker, to open the Midwest’s first semiconductor chip design center, to be housed on Purdue’s campus.

Purdue University will become the first in the country to launch a comprehensive set of innovative, interdisciplinary degrees and credentials in semiconductors and microelectronics.

Ganesh Subbarayan, co-director of Purdue's Center for Heterogenous Integration Research in Packaging (CHIRP), gave a Distinguished Lecture at Georgia Tech's 3D Systems Packaging Research Center, entitled "Reliability Assessment for Heterogeneously Integrated Package."

Semiconductor Research Corporation (SRC), a world-renowned high technology research consortium, announced today that it has been selected by the U.S. Department of Commerce’s National Institute of Standards and Technology’s (NIST) Advanced Manufacturing Office to define the future technology goals of the microelectronics and advanced packaging technology (MAPT) industry.

The U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) has awarded a total of $1.2 million to four organizations to develop technology roadmaps aimed at strengthening U.S. manufacturing and innovation across industries.