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Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus.

Materials Engineering and Environmental and Ecological Engineering's Carol Handwerker was vice chair of the Workforce Development chapter and Mechanical Engineering's Ganesh Subbarayan was vice chair of the Advanced Packaging and Heterogeneous Integration chapter for the first industry-wide 3D semiconductor roadmap to guide the microelectronics revolution.

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing and building of microelectronic systems.

Organized by Purdue University's Institute for Advanced System Integration and Packaging (ASIP) in partnership with ARI, host of the Si Crossroads ME Commons Hub, Osaka University and imec USA.

Purdue faculty served as vice-chairs in leading the writing of chapters on workforce development (Carol Handwerker) and Advanced Packaging (Ganesh Subbarayan). The roadmap will be publicly released on October 20, 2023.

Purdue University continues to be the world leader in creating vital partnerships in semiconductors. Appearing at the recent G7 Summit, President Mung Chiang has announced a string of international agreements with Japan, Greece, India, Belgium, and Taiwan.

Purdue was well-represented at ITherm 2023, winning three paper awards and four poster awards. The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems was held in Orlando, FL in June 2023.

Ganesh Subbarayan is the James G. Dwyer professor of mechanical engineering at Purdue University. In this video, he explains what advanced chip packaging is and how it will keep advancements in this field powerful and cost effective.

Ganesh Subbarayan has been recognized by the Semiconductor Research Corporation (SRC) with its 2022 Technical Excellence Award. He was cited as being the "top researcher for the comprehensiveness and rigor of his approach. He has combined the depth of Fracture & Continuum Mechanics with innovative computational and experimental techniques to describe solder material and stress evolution under different processing and reliability conditions and in the presence of multiple flaws. He co-leads the CHIRP Center to achieve significantly enhanced functionality by heterogeneous packaging of advanced microchips."

U.S. Secretary of State Antony J. Blinken and Secretary of Commerce Gina Raimondo visited Purdue University to tour research facilities and meet students as they embark on their mission to bolster the U.S. semiconductor industry. Sen. Todd Young (R-Ind.) and Indiana Gov. Eric J. Holcomb joined Blinken and Raimondo on a tour of Purdue’s Birck Nanotechnology Center, highlighting the leading-edge research and workforce development efforts at Purdue that can help the United States restore domestic semiconductor manufacturing and competitiveness abroad.