The goal of the Center for Heterogeneous Integration Research in Packaging (CHIRP) is to enable cost-effective Systems-in-Packages (SiPs) of the future, and to produce engineers that will build future heterogeneously integrated systems. Since its inception in 2019, CHIRP has undertaken:

  • 20 research tasks
  • $6 million total in funded projects
  • 19 faculty researchers
  • 53 students
  • 56 industry mentors
  • 234 research publications
  • 4 patent applications

We accomplish all of this by focusing on five sub-areas:

Design Enablement

Global Interconnects

Power Delivery

Thermal Management

Modeling, Metrology and Reliability