News

Purdue University’s College of Engineering is partnering with MediaTek Inc., a leading global fabless chipmaker, to open the Midwest’s first semiconductor chip design center, to be housed on Purdue’s campus.

Purdue University will become the first in the country to launch a comprehensive set of innovative, interdisciplinary degrees and credentials in semiconductors and microelectronics.

Ganesh Subbarayan, co-director of Purdue's Center for Heterogenous Integration Research in Packaging (CHIRP), gave a Distinguished Lecture at Georgia Tech's 3D Systems Packaging Research Center, entitled "Reliability Assessment for Heterogeneously Integrated Package."

Semiconductor Research Corporation (SRC), a world-renowned high technology research consortium, announced today that it has been selected by the U.S. Department of Commerce’s National Institute of Standards and Technology’s (NIST) Advanced Manufacturing Office to define the future technology goals of the microelectronics and advanced packaging technology (MAPT) industry.

The U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) has awarded a total of $1.2 million to four organizations to develop technology roadmaps aimed at strengthening U.S. manufacturing and innovation across industries.

Purdue University and the Semiconductor Research Corporation (SRC) are connecting academic researchers and industrial practitioners together, providing the tools needed for revolutionary research in packaging for more powerful microchips.

Semiconductor Research Corporation (SRC) President and CEO Todd Younkin met with Purdue President Mitch Daniels on November 5.

Purdue University hosted a workshop on the challenges and opportunities of workforce development for microelectronics and advanced packaging. Participants included representatives from Microsoft, AMD, US Department of Commerce, NSF, SRC, and several universities. Watch the whole seminar online!

The Committee advises the Office of the Assistant Secretary for Export Administration on technical questions that affect the level of export controls applicable to information systems equipment and technology.

The cost of computing has been steadily decreasing as companies pack more components and functions onto a single chip, for applications ranging from smartphones to large mainframe computers. Through a new center funded by the Semiconductor Research Corporation (SRC), Purdue University and Binghamton University will improve how to "package," or protect and supply power to, chips of various functions integrated together.