News

Purdue University and the Semiconductor Research Corporation (SRC) are connecting academic researchers and industrial practitioners together, providing the tools needed for revolutionary research in packaging for more powerful microchips.

Semiconductor Research Corporation (SRC) President and CEO Todd Younkin met with Purdue President Mitch Daniels on November 5.

Purdue University hosted a workshop on the challenges and opportunities of workforce development for microelectronics and advanced packaging. Participants included representatives from Microsoft, AMD, US Department of Commerce, NSF, SRC, and several universities. Watch the whole seminar online!

The Committee advises the Office of the Assistant Secretary for Export Administration on technical questions that affect the level of export controls applicable to information systems equipment and technology.

The cost of computing has been steadily decreasing as companies pack more components and functions onto a single chip, for applications ranging from smartphones to large mainframe computers. Through a new center funded by the Semiconductor Research Corporation (SRC), Purdue University and Binghamton University will improve how to "package," or protect and supply power to, chips of various functions integrated together.