News

Semiconductors at Purdue Distinguished Lecture - Ted Letavic Senior Vice President of Technology Innovation at Global Foundries

Purdue University continues to engage in a groundbreaking research and workforce development partnership with GlobalFoundries (GF), a leading manufacturer of essential semiconductors.

Dr. Thomas Caulfield, who has led GlobalFoundries since 2018, steered the company’s initial public offering in October 2021, which was the largest semiconductor IPO on Nasdaq that year. He has an extensive career spanning engineering, executive management and global operational leadership with leading technology companies.

Announcement marks Purdue’s latest, largest strategic research win under CHIPS R&D Program

Seeking to ensure America’s national security and global military leadership, the Defense Advanced Research Project Agency (DARPA) has selected the Texas Institute for Electronics (TIE) at The University of Texas at Austin to develop the next generation of high-performing semiconductor microsystems for the Department of Defense.

Ganesh Subbarayan, James G. Dwyer Professor of Mechanical Engineering, gave two deep dive talks on digital twins as part of the Microelectronics and Advanced Packaging Technologies Roadmap Deep Dive Series. These talks were given on June 7, 2024 and August 9, 2024.

The Richard Chu Award for Excellence in Thermal and Thermo-Mechanical Management of Electronics, formerly known as the ITherm Achievement Award was instituted in 1996 and presented in recognition of significant contributions made in thermal and thermo-mechanical aspects of electronics devices and systems.

SkyWater Technology announced plans to open a $1.8 billion state-of-the-art semiconductor manufacturing facility in Discovery Park District at Purdue University, marking a huge step forward for the American semiconductor industry, Purdue’s thriving innovation district and the university’s continued emergence as one of the principal drivers of the Indiana economy.

SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion to build an advanced packaging fabrication and R&D facility for AI products in the Purdue Research Park.

Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus.