MSE59700 - Advanced Defect Analysis in Semiconductor Materials - The Robert H. Buckman College of Engineering Online Education Program - Purdue University

Credit Hours: 1

Instructor(s): Mohamad Zbib 

Email: mzbib@purdue.edu

Learning Objective:

1. Identify and explain key defects and mechanical phenomena affecting semiconductor performance and reliability.
2. Analyze semiconductor failure mechanisms by linking defects and mechanical behavior to processing, operation, and packaging.
3. Assess semiconductor reliability challenges and propose appropriate mitigation or design strategies.

Description:

This online course examines advanced approaches for analyzing defects in semiconductor materials and understanding their impact on device performance and reliability. The course explores the origins and evolution of defects associated with semiconductor processing, packaging, and operation, with emphasis on the effecrts of stress, deformation, fracture, and other defect-related mechanisms. Through diagnostic tools, real-world case studies, an applied examples, students identify and interpret defects, investigate their causes, and connect defect behavior to practical challenges in microelectronics, advanced packaging, device manufacturing, and reliability.

Topics Covered:

1. Semiconductor Defects
2. Stress and Deformation
3. Fracture and Failure Analysis
4. Processing and Packaging Defects
5. Reliability and Defect Mitigation

Applied / Theory:

100/0

Web Address:

https://purdue.brightspace.com

Homework:

5 assignments

Exams:

5 quizzes

Textbooks:

There is no textbook required for this course. All supporting materials will be provided through the Brightspace system. These resources will be organized by module and include links to journal articles, websites, etc.