LAMPL | LAM OF SILICON NITRIDE |
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Laser-assisted machining of hot-pressed silicon nitride is successful. Without laser-assistance, both the workpiece and [cubic-boron nitride] cutting tool fail catastrophically when the cut is initiated. LAM of silicon nitride with a polycrystalline cubic-boron nitride tool can achieve:
Laser-assisted machining uses a laser to heat the workpiece in the vicinity of the material removal location. At elevated temperatures the yield strength of some brittle materials decreases below the fracture strength, changing the material deformation behavior from brittle to ductile, thereby enabling a "standard" cutting tool to remove material. The following chips produced during LAM of hot-pressed silicon nitride show evidence of plastic deformation during the cutting process.
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MECHANICAL ENGINEERING PURDUE UNIVERSITY |
Copyright © 1999 Dr. Y.C. Shin
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