Purdue signs a series of landmark agreements for semiconductors
April 18: Purdue convenes CHIPS summit in D.C. with Sec. Raimondo and Sen. Young, announces sustainability index and facility investment
Leaders from industry, government and academia convened at a summit on April 18 in Washington, D.C. to forge national solutions at scale to address the future of U.S. innovation in microelectronics and the semiconductor workforce. The full-day CHIPS for America: Execute for Success Summit in Washington, D.C., led by Purdue and U.S. Sen. Todd Young of Indiana at the Russell Senate Office Building in Washington, D.C., convened hundreds of attendees representing over 175 entities from over 23 states, and focused on strategies to execute the vision outlined in the recently released CHIPS for America: Vision for Success. It highlighted the implementation of federal investments and future policy actions, and facilitated the creation of government, industry and academic partnerships with a special focus on workforce development and research innovation.
May 3: US-Europe semiconductors collaboration milestone as Purdue, imec, Indiana announce partnership
Purdue University and the state of Indiana continue to make giant leaps in semiconductor research growth with a first-of-its-kind agreement with cutting-edge European nano- and digital technology innovation hub imec, based in Belgium.
May 10: Purdue and India establish milestone semiconductor alliance; sign partnership in the presence of Minister Ashwini Vaishnaw
Purdue University continues to rapidly expand its global boundaries in semiconductors, announcing a transformative agreement to become the flagship academic partner and collaborator with the government of India. With the announcement, Purdue is established as a key collaborator with India and the India Semiconductor Mission (ISM) in skilled workforce development and joint research and innovation in the burgeoning fields of semiconductors and microelectronics.
May 22: Purdue signs landmark U.S.-Japan agreement in semiconductors at G7 summit
On May 21 in Hiroshima, Japan, Purdue President Mung Chiang signed another landmark international agreement, partnering with Micron, Tokyo Electron and other educational institutions in the United States and Japan to establish the “UPWARDS Network” for workforce advancement and research and development in semiconductors.
June 5: Purdue launches partnership with Greek universities and business chamber, deepens collaboration with European semiconductor hub in Belgium
Purdue University continues to broaden and widen its global footprint with the signing of a series of Memoranda of Understanding with four leading research universities in Greece, at a time when the U.S. and Greece enjoy a very strong relation. The STEM-focused MOUs mark the fourth international partnership that Purdue has announced over the past three weeks. A fifth MOU also was signed between Purdue and the American-Hellenic Chamber of Commerce, whose primary focus is to promote and foster economic and business relationships between the United States and Greece.
June 22: Purdue and Taiwan Semiconductor Manufacturing Co. extend partnership on semiconductor research and workforce development
Purdue University continues to advance semiconductor workforce development by renewing a strong partnership between industry leader Taiwan Semiconductor Manufacturing Co. and the university’s Center for Secure Microelectronics Ecosystem.