News

Seeking to ensure America’s national security and global military leadership, the Defense Advanced Research Project Agency (DARPA) has selected the Texas Institute for Electronics (TIE) at The University of Texas at Austin to develop the next generation of high-performing semiconductor microsystems for the Department of Defense.

Ganesh Subbarayan, James G. Dwyer Professor of Mechanical Engineering, gave two deep dive talks on digital twins as part of the Microelectronics and Advanced Packaging Technologies Roadmap Deep Dive Series. These talks were given on June 7, 2024 and August 9, 2024.

The Richard Chu Award for Excellence in Thermal and Thermo-Mechanical Management of Electronics, formerly known as the ITherm Achievement Award was instituted in 1996 and presented in recognition of significant contributions made in thermal and thermo-mechanical aspects of electronics devices and systems.

SkyWater Technology announced plans to open a $1.8 billion state-of-the-art semiconductor manufacturing facility in Discovery Park District at Purdue University, marking a huge step forward for the American semiconductor industry, Purdue’s thriving innovation district and the university’s continued emergence as one of the principal drivers of the Indiana economy.

SK hynix Inc. announced Wednesday (April 3) that it plans to invest close to $4 billion to build an advanced packaging fabrication and R&D facility for AI products in the Purdue Research Park.

Purdue University will recognize the impact of alumnus and semiconductor pioneer John Atalla with the naming of the newest system integration and packaging research institute on campus.

Materials Engineering and Environmental and Ecological Engineering's Carol Handwerker was vice chair of the Workforce Development chapter and Mechanical Engineering's Ganesh Subbarayan was vice chair of the Advanced Packaging and Heterogeneous Integration chapter for the first industry-wide 3D semiconductor roadmap to guide the microelectronics revolution.

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing and building of microelectronic systems.

Organized by Purdue University's Institute for Advanced System Integration and Packaging (ASIP) in partnership with ARI, host of the Si Crossroads ME Commons Hub, Osaka University and imec USA.

Purdue faculty served as vice-chairs in leading the writing of chapters on workforce development (Carol Handwerker) and Advanced Packaging (Ganesh Subbarayan). The roadmap will be publicly released on October 20, 2023.