News

Ganesh Subbarayan has been recognized by the Semiconductor Research Corporation (SRC) with its 2022 Technical Excellence Award. He was cited as being the "top researcher for the comprehensiveness and rigor of his approach. He has combined the depth of Fracture & Continuum Mechanics with innovative computational and experimental techniques to describe solder material and stress evolution under different processing and reliability conditions and in the presence of multiple flaws. He co-leads the CHIRP Center to achieve significantly enhanced functionality by heterogeneous packaging of advanced microchips."

U.S. Secretary of State Antony J. Blinken and Secretary of Commerce Gina Raimondo visited Purdue University to tour research facilities and meet students as they embark on their mission to bolster the U.S. semiconductor industry. Sen. Todd Young (R-Ind.) and Indiana Gov. Eric J. Holcomb joined Blinken and Raimondo on a tour of Purdue’s Birck Nanotechnology Center, highlighting the leading-edge research and workforce development efforts at Purdue that can help the United States restore domestic semiconductor manufacturing and competitiveness abroad.

SkyWater Technology announced plans to open a $1.8 billion state-of-the-art semiconductor manufacturing facility in Discovery Park District at Purdue University, marking a huge step forward for the American semiconductor industry, Purdue’s thriving innovation district and the university’s continued emergence as one of the principal drivers of the Indiana economy.

Purdue University’s College of Engineering is partnering with MediaTek Inc., a leading global fabless chipmaker, to open the Midwest’s first semiconductor chip design center, to be housed on Purdue’s campus.

Purdue University will become the first in the country to launch a comprehensive set of innovative, interdisciplinary degrees and credentials in semiconductors and microelectronics.

Ganesh Subbarayan, co-director of Purdue's Center for Heterogenous Integration Research in Packaging (CHIRP), gave a Distinguished Lecture at Georgia Tech's 3D Systems Packaging Research Center, entitled "Reliability Assessment for Heterogeneously Integrated Package."

Semiconductor Research Corporation (SRC), a world-renowned high technology research consortium, announced today that it has been selected by the U.S. Department of Commerce’s National Institute of Standards and Technology’s (NIST) Advanced Manufacturing Office to define the future technology goals of the microelectronics and advanced packaging technology (MAPT) industry.

The U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) has awarded a total of $1.2 million to four organizations to develop technology roadmaps aimed at strengthening U.S. manufacturing and innovation across industries.

Purdue University and the Semiconductor Research Corporation (SRC) are connecting academic researchers and industrial practitioners together, providing the tools needed for revolutionary research in packaging for more powerful microchips.

Semiconductor Research Corporation (SRC) President and CEO Todd Younkin met with Purdue President Mitch Daniels on November 5.