Intro to Electronics Packaging and Heterogeneous Integration - ECE59500/ME597000
This course leverages both theoretical and laboratory-based instruction methods to introduce concepts needed for an introductory understanding of the design and characterization of modern electronic packages. The course is based on a 15-week online module delivery format for both lectures and labs.
Credit Hours: 3
Instructor(s): Shubhra Bansal, Ganesh Subbarayan
Shubhra Bansal Phone: (765) 494-9770
Email: bansal91@purdue.edu, gss@purdue.edu
Ganesh Subbarayan Office: 302
Learning Objective:
Upon completion of the course, a student will have an introductory understanding of electronic packaging and be able to apply the acquired knowledge to design and characterize heterogeneously integrated electronic systems. A student who successfully fulfills the course requirements will have demonstrated an ability to:
- Introduce and motivate heterogeneous integration
- Model and characterize electrical, mechanical, and thermal behavior
- Understand material science and materials selection
- Understand manufacturing processes relevant to electronic packaging
- Develop statistical and data models to describe electronic package failure
- Explain radiation hardening and its impact on electronics packaging
Topics Covered:
| Topic | |
|---|---|
| 1 | Overview of electronics packaging |
| 2 | Electrical design and characterization |
| 3 | Thermal Design and characterization |
| 4 | Mechanical design and characterization |
| 5 | Material selection and characterization |
| 6 | Package fabrication |
| 7 | Statistical modeling and data analysis |
| 8 | Radiation hardening |
Homework:
Quizzes and Lab Assignments
Exams:
Final Exam
Textbooks:
Recommended texts:
- Circuits Interconnections and Packaging of VLSI, H.B. Bakoglu, Addison-Wessley, 1990, ISBN No. 9780201060089
- Design and Modelling for 3D ICs and Interposers, S. Madhavan and K.J. Han, World Scientific Publishing Company, 2013, ISBN No. 9789814508599
- Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition, R. Tummala, McGraw-Hill Publishing Company, 2019, ISBN No. 9781259861550
- Fundamentals of Microsystems Packaging, R. Tummala, McGraw-Hill Publishing Company, 2001, ISBN No. 9780071371698
- High Speed Signaling: Jitter Modelling Analysis and Budgeting, K.S. Oh and X. Yuan, Prentice Hall, 2012, ISBN No. 9780132826914
- Power Integrity Modeling and Design for Semiconductors and Systems, S. Madhavan and E. Engin, Prentice Hall, 2008, ISBN No. 9780136152064