Heterogeneous Integration Design and Characterization (HIDAC) Lab

Research in the Heterogeneous Integration Design and Characterization (HIDAC) labs, here at Purdue University is broadly concerned with computational and experimental solid mechanics as well as CAD with applications to characterizing failure of microelectronic components and assemblies.

The specific focus within these areas is on isogeometric analysis, multi-physics modeling of moving interfaces and boundaries including fracture propagation, shape and topological optimal design as well as in thermal conduction in particulate composites.

Comparison between explicit, NURBS-based isogeometric simulations (of effective thermal conductivity) of particle filled TIMs.

Left: packing methodology showcasing 200,000 ellipsoids. Right: NEMD simulation system of silica nanowire.

Simulations of crack initiation and propagation in chip-dielectric stacks.

Algebraic level sets constructed from low-degree parametric surfaces.

Explicit interface EIGA simulations of void and Cu6Sn5 intermetallic compound (IMC) growth in solder microbumps.

Isoparametric descriptions of the NURBS geometrical surfaces.

Micro and Nano-precision mechanical testers - to characterize behavior of TIMs and solders