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Semiconductors

Banner image: In a symbolic effort to inspire our readers, the communications team incorporated AI into the design of the golden semiconductor. It was created using MidJourney, an AI program that incorporates the same research that is currently being expanded upon at Purdue University. 

Purdue University is uniquely positioned to offer a full range of options for partners interested in semiconductors and microelectronics: research and development, workforce development, and business growth.

All full-length stories can be found on the semiconductors website.

Purdue, TSMC extend tnership on semiconductor research and workforce development

Purdue University has continued to advance semiconductor workforce development by renewing a strong partnership between industry leader Taiwan Semiconductor Manufacturing Co. and the university’s Center for Secure Microelectronics Ecosystem (CSME).

The renewal of TSMC’s membership in CSME represents the desire by both sides to expand their collaborative scope through additional workforce development and research programs through 2031. CSME started in 2021 as a first-of-its-kind global partnership of academia; industry, including TSMC; and government to advance research and workforce development in designing secure microelectronics.

The memorandum of understanding is the latest in a series of recent Purdue partnership agreements that expand the University’s global reach in the semiconductor industry, including three transformative agreements signed in May 2023.

“As America’s leading semiconductor university in workforce, research and industry partnership, Purdue is excited to renew, update and expand the collaboration with TSMC, especially in light of the recently announced joint activities with key engineering universities in Taiwan in this area,” Purdue President Mung Chiang said. “This is now the fourth global partnership in less than two months — including Belgium, India and Japan — that Purdue has formed to enhance our commitment to the semiconductor ecosystem.” 

As part of the partnership extension, TSMC and Purdue will work in tandem on additional educational and research projects. Additional workforce development activities, graduate fellowships and research assistantships are included in the new agreement. 

The agreement is the latest as part of the Semiconductors@Purdue initiative, which addresses research and workforce and economic development. TSMC is one of the world’s largest semiconductor contract manufacturers.

Since 2022, investments in the future workforce and semiconductor research have also drawn innovative neighbors to Purdue. U.S.-owned semiconductor manufacturer SkyWater Technology and Taiwan’s MediaTek Inc., the world’s fourth-largest chip designer by revenue, have each in the last year announced partnerships with Purdue.

Purdue’s Semiconductor Degrees Program addresses the needs of the commercial semiconductor industry by working in close collaboration with 27 senior leaders of the semiconductor industry. The program is a model curriculum to address the critical shortage of talent faced by the U.S. semiconductor industry.

Purdue-Japan landmark agreement to establish ‘UPWARDS Network’

Purdue University President Mung Chiang at the G7 Summit in Hiroshima, Japan, signed another landmark international agreement to advance Purdue’s efforts in semiconductors production. Purdue is partnering with Micron, Tokyo Electron and other educational institutions in the U.S. and Japan to establish the “UPWARDS Network” for workforce advancement and research and development in semiconductors.

(Photo credit: Purdue University)

Purdue leadership forms task force to take growing semiconductors program to next level

The President’s Semiconductor Task Force will coordinate and lead Purdue’s efforts toward innovative research and development through the CHIPS for America and Science Act approved in Washington, D.C., last year. Leading the task force is Mark Lundstrom, the Don and Carol Scifres Distinguished Professor of Electrical and Computer Engineering, as chief semiconductor officer for Purdue and senior advisor to President Mung Chiang.

(Photo credit: Purdue University)

Purdue hosts inaugural USA-India Semiconductor Collaborative

Nearly 36 representatives from leading U.S. tech companies and Indian government officials took part in the inaugural USA-India Semiconductor Collaborative, hosted by Purdue and semiconductor industry organization SEMI in Washington, D.C. The event coincided with the official state visit of Indian Prime Minister Narendra Modi.

(Photo credit: Purdue University | Pooja Chaudhary)

Visit by delegation of Taiwan university, industry partners builds on semiconductor collaborations

Purdue President Mung Chiang and Chi-Hung Lin, president of Taiwans National Yang Ming Chiao Tung University, signed an MOU to partner in academic research and workforce development efforts in semiconductors.

(Photo credit: Purdue University | Vincent Walter)

Chi-Hung Lin presents a gift to Arvind Raman, dean of College of Engineering.

(Photo credit: Purdue University)

Purdue convenes CHIPS summit in D.C. with Sec. Gina Raimondo and Sen. Todd Young, announces sustainability index and facility investment

Leaders from industry, government and academia convened at a summit in April in Washington, D.C., to forge national solutions at scale to address the future of U.S. innovation in microelectronics and the semiconductor workforce.

(Photo credit: Purdue University)

Purdue signs tech-focused MOUs with Taiwan universities

Purdue University and the Krach Institute for Tech Diplomacy at Purdue on June 15 signed memorandums of understanding with two research universities in Taiwan, the worlds largest producer of microchips. The MOUs are in partnership with research universities in Taiwan: National Yang Ming Chiao Tung University (NYCU) in Hsinchu and National Chengchi University (NCCU), a public research university in Taipei.

From left, Keith Krach, co-founder of the Krach Institute for Tech Diplomacy; Purdue President Mung Chiang; Chi-Hung Lin, president of National Yang Ming Chiao Tung University; and Bi-khim Hsiao, Taiwan's representative to the U.S.

(Photo credit: Purdue University | Rebecca Robiños)

Purdue partners with European-based semiconductor research and development innovation hub

Business, governmental and Purdue leaders took part in an announcement of a partnership between European-based imec and Purdue University.

Pictured from left are Joe Pasetti, imec vice president of corporate affairs; Jimmy Costa, senior vice president of innovation and semiconductor strategy, Applied Research Institute Inc.; Max Mirgoli, imec executive vice president of worldwide strategic partnerships; Mark Lundstrom, Purdue's chief semiconductor officer and senior advisor to the university president; Purdue President Mung Chiang; Indiana Secretary of Commerce Brad Chambers; U.S. Sen. Todd Young; Indiana Gov. Eric Holcomb; imec CEO Luc Van Den Hove; and Jillian Turner, senior vice president, global investment and partnerships, Indiana Economic Development Corporation.

(Photo credit: Purdue University)

STARS: Summer program helps students develop skills for growing semiconductor industry

The new: Purdue Summer Training, Awareness, and Readiness for Semiconductors (STARS) program already has received support from key players in the semiconductor industry, including Intel, Cisco, GlobalFoundries, SK hynix, TI, L3Harris, Western Digital and Synopsys.

(Photo credit: Purdue University)