From the Dean

This issue of FRONTIERS highlights many examples of Purdue Engineering’s continuing progress toward becoming one of the most consequential U.S. engineering colleges. We share information on major research centers, groundbreaking partnerships, new computing synergies, latest semiconductor milestones, impactful research, new patents and innovations, and recognition.

For example, you’ll find stories on: 

The Hypersonics and Applied Research Facility (HARF) – a $41-million, 65,000-square-foot building dedicated to enhancing Purdue’s world-leading capabilities in hypersonics evaluation and testing. HARF houses the only Mach 8 quiet wind tunnel in the world and the hypersonic pulse (HYPULSE) reflected shock/expansion tunnel.

A $50-million, five-year extension of Purdue’s research agreement with Eli Lilly – part of a broader pact including pharmaceutical manufacturing scholarships. The new expansion involves collaborative research focused on genetic medicine, as well as drug delivery methods for better patient outcomes and experiences.

The eXcellence in Manufacturing and Operations (XMO) initiative – an academic-government-industry partnership to drive Purdue efforts to spearhead a U.S. resurgence at the intersection of physical, digital and sustainable manufacturing. This initiative transcends Engineering to solve complex problems in such areas as microelectronics manufacturing, food equity, Space 2.0 for commerce and security, the greater good, and sustainability.

Purdue University in Indianapolis – Purdue’s first comprehensive urban campus, which will provide unique opportunities to students, faculty and partners in Indianapolis and West Lafayette. The new university, to begin operating July 1, 2024, will assume responsibility for existing engineering, computer science and technology programs at IUPUI and confer Purdue West Lafayette degrees, as Purdue gains ability to introduce programs and grow enrollments in Indianapolis.

Our increasing primacy in semiconductors – demonstrated by a $49 million Purdue investment in the Birck Nanotechnology Center, including its semiconductor cleanroom, and new or renewed international research and workforce development partnerships. Among partners are Taiwan Semiconductor Manufacturing Co. (TSMC), Taiwan’s National Yang Ming Chiao Tung University (NYCU), National Chengchi University (NCCU), and European-based innovation hub imec. You’ll also learn about engagement with leading tech companies and government officials from India, Europe, Japan and the U.S. to advance R&D collaborations.

Additional topics in this issue include a new $20 million center for transportation cybersecurity; the world’s whitest paint, which can reduce air-conditioning needs; and a $70 million program that applies a “LASER” focus to humanitarian supply chains.