An introduction to this issue of FRONTIERS magazine by Dean Arvind Raman
From the Dean

ARVIND RAMAN
John A. Edwardson Dean of the College of Engineering
Robert V. Adams Professor in Mechanical Engineering
Professor of Materials Engineering (by Courtesy)
Purdue University
Purdue Engineering continues charting momentous advances toward fulfilling its Vision 2030 — to be the most consequential engineering college in the nation. As we celebrate our College's 150th anniversary year, we are proud to share recent giant leaps that extend our impact on the world and pave the way for further breakthroughs.
This issue of FRONTIERS illustrates excellence at scale spanning:
National center/semiconductor manufacturing: Purdue has become the beating heart of the semiconductor heartland and without a doubt the nation’s leading semiconductor university. Just last month, the Dept of Commerce announced a combined $1B investment in a new CHIPS Manufacturing USA Institute – called the SMART USA Institute – to develop, validate, and use "digital twins" to improve domestic semiconductor design, manufacturing, advanced packaging, assembly, and test processes. This was a tough national competition with one winner taking it all. I am proud to say that Purdue is the lead academic institution in this industry-led consortium and helped conceptualize the institute as a member of the founding executive committee. Birck Nanotechnology Center, already the nation’s largest academic semiconductor research facility, will now become a national hub for developing and applying digital twins for semiconductor manufacturing and R&D, working in close collaboration with strong industry partners. This milestone underscores Purdue's unwavering commitment to driving innovation, enabling critical technological advancements, and educating the next generation of semiconductor pioneers. Together, we continue to shape the future of this transformative industry.
Manufacturing milestones: expansion of Manufacturing and Materials Research Laboratories across the Hard-Tech Corridor, the LyoHUB2040 Tech Roadmap, the $73-million High-Speed Propulsion Lab at Zucrow Laboratories, and a panel discussion of AI in manufacturing across the I-65/I-75 smart corridor.
Major research centers and partnerships: Purdue’s new Institute of CHIPS and AI, SK hynix's nearly $4 billion facility investment to boost advanced packaging of AI memory chips, a partnership with Dassault Systèmes to transform semiconductor workforce development, a collaboration with Quanser to enhance autonomous and connected systems education and research, a Defense Innovation initiative to meet national security challenges on the global stage, and a Smart Crossroads ecosystem to drive creative logistics 4.0.
Academic strides: lengthening the streak of our most-ever top 10 undergraduate rankings and launching an online engineering doctorate.
Organizational developments: merging our civil and construction engineering schools, naming our industrial engineering school to honor an alumnus' $25 million in philanthropic commitments, and receiving a sesquicentennial tribute in the U.S. Senate.
Manufacturing
LyoHUB2040 Technology Roadmap for Pharma/Biotech Manufacturing
November 06, 2024
Manufacturing and Materials Research Laboratories to establish Indianapolis presence
November 06, 2024
Zucrow Laboratories celebrates 75 years, dedicates new lab
December 06, 2024
Purdue named lead academic institution in $1B national center focused on ‘digital twins’ for semiconductor manufacturing and advanced packaging
December 16, 2024
Major Research Centers and Partnerships
Quanser partnership to create educational experiences, fuel research in autonomous and connected systems
November 04, 2024
New institute to redefine AI and semiconductor research at Purdue and beyond
November 05, 2024
Defense Innovation PEI to meet national security challenges on the world stage
November 06, 2024
Purdue-Dassault Systèmes partnership aims to transform semiconductor workforce development
November 06, 2024
Purdue's Smart Crossroads is at the center of creative logistics 4.0
November 06, 2024
SK hynix to invest nearly $4B in advanced packaging fabrication and R&D facility for AI memory chips
November 06, 2024
Organizational Developments
Sen. Mike Braun honors Purdue Engineering's sesquicentennial
November 05, 2024
CE, CEM merge to become Lyles School of Civil and Construction Engineering
November 06, 2024
School of Industrial Engineering named for Edwardson following $25M in philanthropic commitments
November 06, 2024
