[Bnc-faculty-all-list] CMP System, ON BEHALF OF JOHN WEAVER

[Deborah S Starewich]

> BNC Faculty Member –
>
> We currently have an unused chemical-mechanical polishing system in  
> BRK 2031.  This is a specialized system purchased by Steve Beaudoin  
> for the removal of copper from substrates, and has no thickness  
> controls, etc.  It can be used as a manual system only.  Steve no  
> longer has a need for this system.
>
> The cost to bring this system into operation for manual wafer  
> thinning, etc., is between $30k and $40k.  Currently there has been  
> no interest by any faculty members to use this system.  Under these  
> circumstances, it is recommended that the system be moved out of  
> the laboratory and the space made available for other equipment.
>
> If you have an interest in this system and the funding to bring it  
> into operation, please let me know right away.  If not, we will  
> proceed with the removal of this system.
>
> Thank you for your assistance in this matter,
>
> John
>
> John R. Weaver
> Facility Manager
> Birck Nanotechnology Center
> Purdue University
> (765) 494-5494
> jrweaver at purdue.edu
>




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