Vikash Gunalan
Vikash Gunalan is an undergraduate researcher in Mechanical Engineering at Purdue University. His work focuses on experimental and computational analysis of thermal interface materials (TIMs) for semiconductor packaging, emphasizing thermal-mechanical reliability and material characterization. He has designed and fabricated custom testing rigs for submerged liquid-cooled environments and integrates ANSYS, MATLAB, and Python for simulation and data analysis. Outside of research, Vikash has experience in semiconductor design, precision manufacturing, and energy storage analytics. He is a Teaching Assistant for ME264. He previously interned at Globus Medical as a CNC Manufacturing Intern and was in the STARS program at Purdue as a Semiconductor Design Engineering Intern. |
