Satish Patel
Satish is an undergraduate student in Mechanical Engineering at Purdue University. His work focuses on Ansys-based computational modeling of two-phase jet impingement cooling, specifically exploring novel surface geometries. Satish has had previous experience designing 2.5D interposers, looking at reliability of FCBGA packages using FEA, and PCB design. He has completed industry internships at AMD and GlobalFoundries as well as completed the STARS program at Purdue in the advanced packaging track. |
