Research

Ongoing Projects
Software Release
Jobs

Ongoing Projects

  • - High-Capacity Computational Electromagnetic Methods
  • - Electromagnetic Solutions for High-Frequency Mixed-Signal IC Design (Completed)
  • - Accurate and Fast Broadband Modeling of the Die-Package Interaction (Completed)
  • - A Hierarchical Matrix Framework for Electromagnetics-Based Analysis and Design of Next-Generation ICs (NSF)
  • - From O(N) to O(M): Scalable Algorithms for Large Scale Electromagnetics-Based Analysis and Design of Next Generation VLSI Circuits
  • - Simulation, Design and Fabrication of Interconnect Programmable Microwave Arrays (NSF, Completed)
  • - Rigorous and Fast Physics-Based Co-Simulation of Device-Structure-Material Interactions in Complex, Nonlinear, and Time-Variant Mixed-Signal Circuits (ONR, Completed)
  • - Direct Matrix Solutions of Linear Complexity for Rapid Modeling and Design of High Bandwidth Package Interconnects (SRC, Completed)
  • - Say "No" to Extraction - A Transformative Circuit Simulation Paradigm Guided by First Principles (NSF, Completed)
  • - Method for Fast and Accurate Signaling Analysis of Non-LTI Systems (Intel, Completed)
  • - Solution to a Few Open Problems in Inverse Design for High-Performance Integrated Circuit Synthesis in Full Electromagnetic Spectrum (DARPA, Completed)
  • - Multiphysics Simulation Algorithms and Experimental Methods for the Development of Cu/Graphene/TMD Hybrid Interconnect Solution (NSF, Completed)
  • - ERI Design: IDEA: Rapid Modeling and Analysis Framework for Full-Chip/Package/Board Layout Automation (DARPA, completed)
  • - Consortium for Electromagnetic Science and Technology (Synopsys, Cadence, Siemens, and Ansys)
  • - Limits to two-spin-qubit gate fidelity from vacuum fluctuations (DARPA, completed)
  • - Fast Method for High-Dimensional Global Optimization and Its Application to System Design Optimization (Intel, completed)
  • - First-Principles Simulation of SKY130 Devices (Google)
  • - Open, Multiscale, Application-Agnostic Platform (Open-MAP) for Heterogeneous System-in-Package Co-Design (NSF, 2023 - )
  • - Rapid Heterogeneous Integration (Rapid-HI) Design Institute (Purdue Elmore ECE Emerging Frontiers Center, 2023 - )
  • - Readying TCAD for transient, DFT based quantum transport in the THz regime (DARPA, completed)
  • - UPWARDS for the Future (Micron and TEL) (2023 - )
  • - NGMM program (DARPA) (2024 - 2029)
  • - GENIE-RFIC: Generative ENgine for Intelligent and Expedited RFIC Design, Artificial Intelligence Driven RF Integrated Circuit Design Enablement (AIDRFIC) (Natcast) (2025 - )
  • - Multiphysics-Informed ML-Assisted Co-Design of Advanced Systems in Package (SRC) (2025 -)

Software Release

  • - gds2Para: First-Principles Based Complete Integrated Circuit (IC), Package, and Board Layout Analysis from GDSII Design File to Electrical Parameters such as R, C, L, full-wave impedance, and S-parameters.
  • Open Source at https://github.com/purdue-onchip/gds2Para
  • - Linear Complexity Direct FEM and Integral Equation Solvers
  • - Fast Nonlinear Signaling Analysis Tool
  • - Fast High-Dimensional and Global Optimzation Tool

Jobs

New positions for RAs and PostDocs are open. Interested applicants are welcome to contact Prof. Jiao at djiao@purdue.edu.