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2008 IEEE International Ultrasonics Symposium (IUS)
Beijing International Convention Center (BICC)
Beijing, China, November 2-5, 2008 (View: Conf. Photos/Videos and * Confucius * Beijing Photos * Color Picture * )
* IEEE UFFC *
Sponsored by the IEEE Ultrasonics, Ferroelectrics, and Frequency Control Society
 * IEEE *
In Cooperation with the Acoustical Society of China and the Institute of Acoustics, Chinese Academy of Sciences
(By December 31, 2008, there have been 3065 visits since July 4, 2007) (2893 by November 11, 2008)

Technical Program Committee (TPC) (136 Members)

Group 1: Medical Ultrasonics
  Vice Chair of TPC:
  Stanislav Emelianov, Ph.D.
  University of Texas at Austin
  Austin, Texas, U.S.A.

  Members:
  1. Olivier Basset: CREATIS, Université Lyon I, France
  2. Geneviève Berger: National Centre for Scientific Research (CNRS), France
  3. Ayache Bouakaz: INSERM, Université Tours, France
  4. Charles Cain: University of Michigan, USA
  5. Richard Chiao: Siemens Medical Solutions, USA
  6. Jan D'hooge: Catholic University Leuven, Belgium
  7. Paul Dayton: UNC Chapel Hill and NC State University, USA
  8. Emad Ebbini: University of Minnesota, USA
  9. David Evans: University of Leicester, UK
  10. Kathy Ferrara: University of California Davis, USA
  11. Stuart Foster: University of Toronto, Canada
  12. James Greenleaf: Mayo Clinic College of Medicine, USA
  13. Anne Hall: General Electric Medical Systems, USA
  14. Christopher Hall: Philips Research North America, USA
  15. Peter Hoskins: The University of Edinburgh, UK
  16. John Hossack: University of Virginia, USA
  17. Kullervo Hynynen: University of Toronto, Canada
  18. Michael F. Insana: University of Illinois, Urbana-Champaign, USA
  19. Jorgen Jensen: Technical University of Denmark, Denmark
  20. Nico de Jong: Erasmus Medical Centre and University of Twente, The Netherlands
  21. Hiroshi Kanai: Tohoku University, Japan
  22. Jeff Ketterling: Riverside Research Institute, USA
  23. Michael Kolios: Ryerson University, Canada
  24. Chris de Korte: Radboud University Nijmegen Medical Centre, The Netherlands
  25. Nobuki Kudo: Hokkaido University, Japan
  26. Pai-Chi Li: National Taiwan University, Taipei, Taiwan
  27. Jian-yu Lu: University of Toledo, USA
  28. Leonardo Masotti: Università degli Studi di Firenze, Italy
  29. Tom Matula: University of Washington, USA
  30. James G. Miller: Washington University in Saint Louis, USA
  31. Kathy Nightingale: Duke University, USA
  32. William O'Brien: University of Illinois, Urbana-Champaign, USA
  33. Georg Schmitz: Ruhr-Universität Bochum, Germany
  34. Ralf Seip: Philips Research North America, USA
  35. Mickael Tanter: Laboratoire Ondes et Acoustique, ESPCI, France
  36. Tom Thomas: Boston Scientific, Inc., USA
  37. Kai Thomenius: General Electric's Corporate R&D, USA
  38. Hans Torp: Norwegian University of Science and Technology, Norway
  39. Piero Tortoli: Università degli Studi di Firenze, Italy
  40. Ton van der Steen: Erasmus Medical Center, The Netherlands
  41. Keith Wear: US Food and Drug Administration, USA

Group 2: Sensors, NDE, and Industrial Application
  Vice Chair of TPC:
  Jafar Saniie, Ph.D.
  Illinois Institute of Technology
  Chicago, Illinois, U.S.A.

  Members:
  1. Robert C. Addison: Rockwell Science Center, USA
  2. Walter Arnold: Fraunhofer Institute for Nondestructive Testing, Germany
  3. Nihat Bilgutay: Drexel University, USA
  4. Ramazan Demirli: Canfield Scientific, USA
  5. Eric S. Furgason: Purdue University, USA
  6. David Greve: Carnegie Mellon University, USA
  7. Edward Haeggstrom: University of Helsinki, Finland
  8. Jacqueline Hines: Applied Sensor Research and Development Corporation, USA
  9. Fabien J. Josse: Marquette University, USA
  10. Lawrence W. Kessler: Sonoscan Inc., USA
  11. Pierre T. Khuri-Yakub: Stanford University, USA
  12. Mario Kupnik: Stanford University, USA
  13. Jun-ishi Kushibike: Tohoku University, Japan
  14. Roman Maev: University of Windsor, Canada
  15. Kentaro Nakamura: Tokyo Institute of Technology
  16. Massimo Pappalardo: University di Roma TRE, Italy
  17. Tony Sinclair: University of Toronto, Canada
  18. Bernhard Tittman: Pennsylvania State University, USA
  19. Jiromaru Tsujino: Kanagawa University, Japan
  20. John F. Vetelino: University of Maine, USA
  21. Paul Wilcox: University of Bristol, UK
  22. Donald E. Yuhas: Industrial Measurement Systems, Inc., USA

Group 3: Physical Acoustics
  Vice Chair of TPC:
  Yook-Kong Yong, Ph.D.
  Rutgers University
  Piscataway, New Jersey, U.S.A.

  Members:
  1. Robert Aigner: TriQuint Semiconductor, USA
  2. Art Ballato: U.S. Army, USA
  3. Jan Brown: JB Consulting, USA
  4. Weiqiu Chen: Zhejiang University, China
  5. David Hecht: DLH Consulting, USA
  6. Fred Hickernell: Retired from Motorola, USA
  7. Yonkee Kim: U.S. Army, USA
  8. Amit Lal: Cornell University, USA
  9. C.S. Lam: Epson Electronics America, Inc., USA
  10. John Larson: Avago Technologies, USA
  11. Moises Levy: Department of Physics, Naples, Florida, USA
  12. George Mansfeld: Russian Academy of Sciences, Russia
  13. Vitold Poghar: Scientific and Technological Center of Unique Instrumentation of Russian Academy of Science, Russia
  14. Valeri Proklov: Institute of Radio Engineering & Electricity, Russia
  15. Edgar Schmidhammer: EPCOS, Germany
  16. Susan Schneider: Marquette University, USA
  17. Bikash Sinha: Schlumberger-Doll Research, USA
  18. Ji Wang: Ningbo University, China
  19. Qing-Ming Wang: University of Pittsburgh, USA

Group 4: Microacoustics - SAW, FBAW, MEMS
  Vice Chair of TPC:
  Peter Smith, Ph.D.
  McMaster University
  Hamilton, Ontario, Canada

  Members:
  1. Sylvain Ballandras: LPMO, France
  2. Kushal Bhattacharjee: RF Micro Devices, USA
  3. Sergey Biryukov: Leibniz Institute for Solid State and Materials Research Dresden (IFW), Germany
  4. Jidong Dai: RF Monolithics, USA
  5. Yasuo Ebata: Fujitsu Media Device Ltd., Japan
  6. Gernot Fattinger: Sawtek, USA
  7. Ken-ya Hashimoto: Chiba University, Japan
  8. Daniel Hauden: CNRS_LPMO, France
  9. Mitsutaka Hikita: Kogakuin University, Japan
  10. Chunyun Jian: Nortel Networks, Canada
  11. Jyrki Kaitila: Infineon, Germany
  12. Jan Kuypers: University of California, USA
  13. Ken Lakin: TFR Technologies, USA
  14. Don Malocha: University of Central Florida, USA
  15. David Morgan: Impulse Consulting, UK
  16. Hiroyuki Odagawa: Tohoku University, Japan
  17. Mauricio Pereira da Cunha: University of Maine, USA
  18. Viktor Plessky: GVR Trade SA, Switzerland
  19. Bob Potter: Vectron International, USA
  20. Leonard Reindl: Albert-Ludwigs-University Freiburg, Germany
  21. Arne Ronnekleiv: Norwegian Institute of Technology, Norway
  22. Richard Ruby: Avago Tech, USA
  23. Clemens Ruppel: EPCOS AG - SAW RD SAM, Germany
  24. Takahiro Sato: Samsung, Japan
  25. Marc Solal: Sawtek, USA
  26. Robert Weigel: Friedrich-Alexander University, Germany

Group 5: Transducers and Transducer Materials
  Vice Chair of TPC:
  Scott Smith, Ph.D.
  GE Global Research
  Niskayuna, New York, U.S.A.

  Members:
  1. Sandy Cochran: University of Dundee, UK
  2. Christopher Daft: Siemens Medical Solutions, USA
  3. Levent Degertekin: Georgia Institute of Technology, USA
  4. Charles Emery: Mirabilis Medica, USA
  5. John Fraser: Philips Medical Systems, USA
  6. Jean-Francois Gelly: GE Healthcare, France
  7. Reinhard Lerch: Friedrich-Alexander-Universität Erlangen-Nuremberg, Germany
  8. Geoff Lockwood: Queen's University, Canada
  9. Clyde Oakley: W. L. Gore, USA
  10. Omer Oralkan: Stanford University, USA
  11. Paul Reynolds: Weidlinger Associates, USA
  12. Yongrae Roh: Kyungpook National University, Korea
  13. Ahmad Safari: Rutgers University, USA
  14. Mark Schafer: Sonic Tech Inc., USA
  15. Thomas Shrout: Pennsylvania State University, USA
  16. Kirk Shung: University of Southern California, USA
  17. Stephen Smith: Duke University, USA
  18. Wallace Smith: Office of Naval Research, USA
  19. Yasuhito Takeuchi: Kagoshima University, Japan
  20. Vasandara Varadan: University of Arkansas, USA
  21. Jian Yuan: Boston Scientific, USA
  22. Qiming Zhang: Pennsylvania State University, USA
  23. Qifa Zhou: University of Southern California, USA

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