@article{1757valencia2016, author = "Daniel Valencia and Evan Wilson and Prasad Sarangapani and Gustavo Valencia and Gerhard Klimeck and Michael Povolotskyi and Zhengping Jiang", title = "Grain Boundary Resistance in Nanoscale Copper Interconnections", year = "2016", note = "International Conference on Simulation of Semiconductor Processes and Devices 2016, Nuremberg, Germany, September 6-8", }