%0 Journal Article %J Physical Review Applied %D 2018 %T Grain-Boundary Resistance in Copper Interconnects: From an Atomistic Model to a Neural Network %A Valencia, Daniel %A Wilson, Evan %A Jiang, Zhengping %A Valencia-Zapata, Gustavo %A Wang, KuangChung %A Klimeck, Gerhard %A Povolotskyi, Michael %P 044005 %V 9 %Z Physical Review Applied 9 (4), 044005;doi: 10.1103/PhysRevApplied.9.044005 %1 doi:10.1103/PhysRevApplied.9.044005