@article{1737valencia2018, author = "Daniel Valencia and K. Wang and Y. Chu and Gerhard Klimeck and Michael Povolotskyi", title = "Surface and grain boundary effects on copper interconnects thin films modeling with an atomistic basis", year = "2018", note = "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices, September 24-26, 2018, Austin, TX", }