Phase Change Materials for Thermal Management
Event Date: | April 3, 2018 |
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Students:
Alumni
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Sponsor:
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Goals:Develop a thermal management solution based on phase change materials (PCMs) to be utilized within or in contact with semiconductor packages in order to store energy generated by the package.
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Selected Related Publications
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Two-dimensional surface temperature maps of (a-b) the bare processor die and (c-d) the die with an enclosure containing phase change material (PCM) at two time while running a benchmaring app . At each time, the surface temperature of the PCM shown in (c-d) are significantly cooler than those of the bare die. Temperatures measured within the processor show the processor temperature is significantly lower with the PCM thermal management solution. The dashed lines in (a-b) show the outline of the ~1 cm^2 device and the enclosure containing the PCM in (c-d) is oversized compared to the die. |