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Justin A. Weibel

Justin Weibel

Research Associate Professor

School of Mechanical Engineering
Purdue University
585 Purdue Mall
West Lafayette, IN 47907-2088

Office: ME 1071

Degrees

  • Ph.D. Purdue University, '12
  • B.S. Purdue University, '07

Research Interests

  • Electronics cooling and packaging
  • Phase-change transport phenomena
  • Microscale and nanoscale surface engineering for enhanced thermal transport
  • Multiphase and psychrometric thermal systems
  • Transport in porous materials
  • Microscale diagnostics and sensing

Awards and Recognitions

  • Best Poster Award, International Conference on Environmental Systems, 2017.
  • Best Poster Award (Thermal Management 1: Component Level Track), ITherm 2017.
  • Best Poster Award (Thermal Management 2: System Level Track), ITherm 2017.
  • Outstanding Poster Award (Emerging Technologies & Fundamentals Track), ITherm 2017.
  • Best Paper Award Runner-Up, Best Student Paper (P.K. Mulay Memorial Scholarship), and Best Student Paper, SEMI-THERM 33rd Annual Symposium and Exhibit, 2017.
  • Purdue University Seed for Success Award, NEPTUNE Center for Power and Energy Research, 2016.
  • Best Paper Award (Emerging Technologies Track), ITherm 2016.
  • Outstanding Paper Award, InterPACK/ICNMM 2015
  • Best Poster Award (Fundamental Thermal and Fluid Transport Track), InterPACK/ICNMM 2015.
  • Bravo Award, College of Engineering, Purdue University, 2014.
  • Purdue University Seed for Success Award, Microcooling for Intensely Concentrated Electronics (MicroICE): An Interchip Approach, 2013.
  • Outstanding Paper Award (Thermal Track), InterPACK, 2013
  • ASME Electronic & Photonic Packaging Division (EPPD) Student Member of the Year Award, 2011.
  • Ingersoll-Rand Fellow for Graduate Studies, 2010.
  • Helen and John Lozar Fellow for Graduate Studies, 2007-2009.

Ten Select Publications

J. A. Weibel and S. V. Garimella, Recent advances in vapor chamber transport characterization for high heat flux applications, Adv Heat Transfer 45: 209-301, 2013.
https://doi.org/10.1016/B978-0-12-407819-2.00004-9

G. Patankar, S. Mancin, J. A. Weibel, M. A. MacDonald, and S. V. Garimella, A method for thermal performance characterization of ultra-thin vapor chambers cooled by natural convection, ASME J Electron Packag, in press. (invited; ASME InterPACK/ICNMM Outstanding Paper Award recipient)
https://doi.org/10.1115/1.4032345

J.A. Weibel, S.V. Garimella, and M.T. North, Characterization of evaporation and boiling from sintered powder wicks fed by capillary action, Int J Heat Mass Transfer 53: 4204-4215, 2010. (highlighted as one of the most cited papers in IJHMT since 2010)
http://dx.doi.org/10.1016/j.ijheatmasstransfer.2010.05.043

R.S. Patel, J.A. Weibel, and S.V. Garimella, Characterization of liquid film thickness in slug-regime microchannel flow, International Journal of Heat and Mass Transfer 115 Part A, pp. 1137-1143, 2017.
https://doi.org/10.1016/j.ijheatmasstransfer.2017.08.008

K. K. Bodla, J. A. Weibel and S. V. Garimella, Advances in fluid and thermal transport property analysis and design of sintered porous wick microstructures, J Heat Transfer 135:061202, 2013. (invited; special issue: 75th anniversary celebration of the heat transfer division)
http://dx.doi.org/10.1115/1.4023569

Z. Pan, J.A. Weibel, and S.V. Garimella, A saturated-interface-volume phase change model for simulating flow boiling, Int J Heat Mass Transfer 93, pp. 945-956, 2016.
https://doi.org/10.1016/j.ijheatmasstransfer.2015.10.044

Z. Pan, J. A. Weibel, and S.V. Garimella, Influence of surface wettability on transport mechanisms governing water droplet evaporation, Langmuir 30:9726-9730, 2014.
http://dx.doi.org/10.1021/la501931x

X. Chen, J.A. Weibel, and S.V. Garimella, Exploiting microscale roughness on hierarchical superhydrophobic copper surfaces for enhanced dropwise condensation, Adv Mater Interfaces 2:1400480, 2015. (selected to appear as inside cover article)
https://doi.org/10.1002/admi.201400480

S. Sarangi, J. A. Weibel, and S. V. Garimella, Quantitative evaluation of the dependence of pool boiling heat transfer enhancement on sintered-particle coating characteristics, Journal of Heat Transfer, 139, p. 021502, 2016.
https://doi.org/10.1115/1.4034901

S. V. Garimella, T. Persoons, J. A. Weibel, and L. T. Yeh, Technological drivers in telecom systems and data centers: multiscale thermal, electrical and energy management, Appl Energy 107:66-80, 2013.
http://dx.doi.org/10.1016/j.apenergy.2013.02.047