Professor of Mechanical Engineering, Mechanics of Materials Program Director - National Science Foundation (on leave from Purdue University)
585 Purdue Mall
West Lafayette, IN 47907-2088
- B.S. University of Leoben, Austria, '87
- M.S. University of Leoben, Austria, '90
- Ph.D. University of Leoben, Austria, '94
- Micromechanics of materials
- Damage mechanics
- Computational fracture mechanics
- Design for structural integrity
- Composite materials and manufacturing
- Tissue mechanics
- Finite element method
Awards and Recognitions
Ten Select Publications
P. Bhattacharya, T. Siegmund, "Computational modeling of vibration-induced systemic hydration of vocal folds over a range of phonation conditions," International Journal for Numerical Methods in Biomedical Engineering, (2014) doi: 10002/cnm.2642.
E. Hunter, T. Rieder, T. Siegmund, R.W. Chan, "Strain modulations as a mechanism to reduce stress relaxation in laryngeal tissues," PLoS Computational Biology 9 (2014) Article Number: e90762.
T. Siegmund, M.R. Allen, D.B. Burr, "Can deterministic size effects contribute to fracture and microdamage accumulation in trabecular bone?" Journal of Theoretical Biology 265 (2010) 202-210.
S. Khandelwal, R.J. Cipra, J.S. Bolton, T. Siegmund, "Transverse loading of cellular topologically interlocked solids," International Journal of Solids and Structures 49 (2012) 2394-2403.
S. Varanasi, J.S. Bolton, T. Siegmund, R.J. Cipra, "The low frequency performance of metamaterial barriers based on cellular structures," Applied Acoustics 74 (2013) 485-495.
A. Paul. R.J. Cipra, T. Siegmund, "Robotic manufacturing of near-net-shape components utilizing stereo-imaging and reconfigurable tooling," Journal of Advanced Manufacturing Technology 63 (2012) 999-1009.
A. Mather, R. Cipra, T. Siegmund, "Structural integrity during remanufacture of a topologically interlocked material," International Journal of Structural Integrity 3 (2012) 61-78.
K. Srinivasan, G. Subbarayan, T. Siegmund, "Analysis of wrinkling on irreversible foundations" Thin Solid Films 520 (2012) 5671-5682.
S. Goyal, K. Srinivasan, G. Subbarayan, T. Siegmund, "Thermally-driven buckling delamination test to measure interfacial fracture toughness of thin film systems," Thin Solid Films, 518 (2010) 2056-2064.