Suresh Garimella

Suresh Garimella

R. Eugene & Susie E. Goodson Distinguished Professor of Mechanical Engineering and Chief Global Affairs Officer

School of Mechanical Engineering and Birck Nanotechnology Center
Purdue University
585 Purdue Mall
West Lafayette, IN 47907-2088
Phone: +1 765 49-49095

Degrees

  • B.S. IIT Madras, '85
  • M.S. Ohio State, '86
  • Ph.D. California-Berkeley, '89

Research Interests

  • High-performance cooling technologies
  • Thermal microsystems
  • Energy efficiency in computing and electronics
  • Micro- and nano-scale transport phenomena
  • Solar thermal energy storage
  • Materials processing

Awards and Recognitions

  • 2012 Provost's Award for Outstanding Graduate Mentor, Purdue University
  • Fellow, American Association for the Advancement of Science, 2011, honoring members whose efforts on behalf of the advancement of science or its applications are scientifically or socially distinguished and elected for distinguished and pioneering contributions to the field of thermal transport and energy efficiency with significant and sustained impact on industry.
  • Invited Panelist, Plenary Session on Foundations for Sustainable Partnerships in Teaching and Research, U.S.‐India Higher Education Summit hosted by U.S. Secretary of State Hillary Clinton and Indian Minister of Human Resource Development Kapil Sibal, Washington, D.C., October 13, 2011.
  • Senior Fellow, Energy and Climate Partnership of the Americas (ECPA), U.S Department of State, a regional partnership announced by President Obama at the April 2009 Summit of the Americas to promote clean energy, advance energy security, fight energy poverty, reduce greenhouse gas emissions, support strategies for sustainable landscapes and build capacity for climate change adaptation, starting August 2011
  • Alexander Schwarzkopf Prize for Technology Innovation, 2011, National Science Foundation Industry University Cooperative Research Center (IUCRC) Association
  • Faculty Award of Excellence for Mentoring, Purdue University College of Engineering, 2011
  • Heat Transfer Memorial Award, 2010, American Society of Mechanical Engineers, for innovative and pioneering work on basic and applied problems in microscale heat transfer, thermal management of electronic systems, phase change heat transfer and materials processing, leading to extensive contributions to archival heat transfer literature and an impressive impact on industry
  • Jefferson Science Fellow*, U.S. Department of State, starting August 2010
  • Distinguished Alumnus Award of IIT Madras for 2010, Indian Institute of Technology, Madras in recognition of distinguished contributions to society
  • Allan Kraus Thermal Management Medal, 2009, inaugural award for eminent and demonstrated outstanding achievements in the thermal management of electronic systems and commitment to the field of thermal sciences, American Society of Mechanical Engineers
  • R. Eugene and Susie E. Goodson Distinguished Professorship, Purdue University, December 2009
  • The Harvey Rosten Award for Excellence, 2009, for outstanding work in the field of thermal analysis of electronic equipment, presented at SemiTHERM 2010, Santa Clara, California
  • Distance Teaching Award, 2009, selected by students and presented annually by the Division of Engineering Professional Education of Purdue University to an engineering faculty member who best represents excellence in teaching at a distance
  • Ruth and Joel Spira Award, 2009, for outstanding contributions to the School of Mechanical Engineering and for inspiring students and fostering excellence in commercial or defence product realization
  • R. Eugene and Susie E. Goodson Chair Professorship of Mechanical Engineering, Purdue University, June
  • 2006 Gustus L. Larson Memorial Award, for outstanding achievements in mechanical engineering within 10 to 20 years following graduation, American Society of Mechanical Engineers, 2004
  • Fellow, American Society of Mechanical Engineers, 2002
  • Cray‐Research Professorship, a Named Professorship/Chair established by Cray Research of Wisconsin, Fall 1992 ‐Spring 1999 K16 Clock Award, 2006, for Service to the ASME Heat Transfer Division’s K‐16 Community and Continued
  • Outstanding Contributions to the Science and Engineering of Heat Transfer in Electronics Fellow, Center of Smart Interfaces, Technical University of Darmstadt, Germany, since July 2008
  • Honorary Guest Professor, Xi'an JiaoTong University, Xi'an, China, since June 2006
  • Member, Scientific Council, International Centre for Heat and Mass Transfer (ICHMT), since February 2009
  • Invited Participant, 2006 U.S. Frontiers of Engineering Symposium of the National Academy of Engineering, September 21-23, Ford Research and Innovation Center, Dearborn, Michigan
  • Invited Speaker at the National Academy of Engineering Mechanical Engineering Section, Fall Meeting, (talk entitled "Emerging Mesoscale Thermal Management Technologies"), October 4, 2004
  • Indiana 21st Century Research & Technology Fund Award, for Outstanding Achievement as a member of the 2008 Indiana 21st Century Research & Technology Fund
  • Research Initiation Award, National Science Foundation, 1992
  • UWM Certificate of Distinguished Achievement in Research, Teaching and Service, UWM Department of Mechanical Engineering, 1999
  • UWM Outstanding Teaching Award, in recognition of Excellence in Teaching, 1997, given through a university-wide selection and evaluation process, including classroom visits
  • Graduate School/UWM Foundation Research Award, in recognition of Outstanding Research and Creative Activity, 1995, given through a university-wide selection and evaluation process
  • Top 10 Most Cited Articles, Heat Transfer Engineering (2003-2008) for "Experimental Investigation of the Thermal Performance of Piezoelectric Fans," by T. A????kal??n, S. M. Wait, S. V. Garimella and A. Raman (25(1):4-14, 2004).
  • Top 10 Most Cited Articles, Heat Transfer Engineering (2003-2008) for "Single-Phase Flow and Heat Transport and Pumping Considerations in Microchannel Heat Sinks," by S. V. Garimella and V. Singhal (25(1):15-25, 2004).
  • Most Cited Articles, International Journal of Heat and Mass Transfer (2005-2008) for "Investigation of Heat Transfer in Rectangular Microchannels," by P. S. Lee, S. V. Garimella and D. Liu (48:1688-1704, 2005)
  • Highlights of 2008 selection by editorial board of Journal of Micromechanics and Microengineering for "Electrical Actuation of Dielectric Droplets," N Kumari, V Bahadur, and SV Garimella (18:085018, 2008)
  • First Prize for Best Poster in the Advanced Packaging and Materials track for "Single-Step Fabrication and Characterization of Ultrahydrophobic Surfaces with Hierarchical Roughness," by S Dash, N Kumari, M Dicuangco, and SV Garimella, at The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of Micro, Nano, and Electronic Systems (InterPACK '11), Portland, OR, July 6-8, 2011
  • First Prize for Best Poster in the Thermal Management track for "An Experimentally Validated Model for Transport in Thin, High Thermal Conductivity, Low CTE Heat Spreaders," by R Ranjan, JY Murthy, SV Garimella and D Altman, at The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of Micro, Nano, and Electronic Systems (InterPACK '11), Portland, OR, July 6-8, 2011
  • Best Poster Prize for "Numerical Study of Evaporation Heat Transfer from the Liquid???Vapor Interface in Wick Microstructures," by R Ranjan, JY Murthy and SV Garimella, ASME International Mechanical Engineering Congress and Exposition, Lake Buena Vista, Florida, November 13-19, 2009
  • Best Poster Prize for "Numerical Analysis of Mist-Cooled High Power Components in Cabinets," by N Kumari, V Bahadur, M Hodes, T Salamon, A Lyons, P Kolodner and SV Garimella, at The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of Micro, Nano, and Electronic Systems (InterPACK '09), San Francisco, July 19-23, 2009
  • Best Poster Prize for "Forces acting on Sessile Droplet on Inclined Surfaces," by SR Annapragada, JY Murthy and SV Garimella, at The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of Micro, Nano, and Electronic Systems (InterPACK '09), San Francisco, July 19-23, 2009
  • Best Paper Award in Heat Transfer, for "Permeability and Thermal Transport in Compressed Open-Celled Foams," by SR Annapragada, JY Murthy and SV Garimella, at the 2008 ASME Summer Heat Transfer Conference, Jacksonville, Florida, August 10-14, 2008
  • Best Poster Prize for "Infrared Micro-Particle Image Velocimetry in a Silicon Microchannel Heat Sink," by BJ Jones and SV Garimella, International Heat Transfer Conference, Sydney, Australia, August 13-18, 2006
  • Best Paper Award for "Piezoelectric Fans for the Thermal Management of Electronics," by SM Wait, T A????kal??n, SV Garimella and A Raman, at the Sixth ISHMT/ASME Heat and Mass Transfer Conference, Kalpakkam, India, January 5-7, 2004
  • Society of Automotive Engineers' Outstanding Faculty Advisor Award, 1994
  • Society of Automotive Engineers' Ralph R. Teetor Educational Award, 1992
  • Outstanding Teaching Award, College of Engineering and Applied Science, UW-Milwaukee, 1992
  • The 1986 Ohio State University Engineering Achievement Award for Excellence in Scholarship and Research
  • Listed in Who's Who in Science and Engineering (1992); Who's Who in the World (1994)
  • Ten Select Publications

    R. A. Leffler, C. R. Bradshaw, E. A. Groll and S. V. Garimella, "Alternative Heat Rejection Methods for Power Plants," Applied Energy (in press).

    T. Harirchian and S. V. Garimella, "Flow Regime-Based Modeling of Heat Transfer and Pressure Drop in Microchannel Flow Boiling," International Journal of Heat and Mass Transfer (in press).

    R. Ranjan, A. Patel, S. V. Garimella and J. Y. Murthy, "Wicking and Thermal Characteristics of Micropillared Structures for use in Passive Heat Spreaders," International Journal of Heat and Mass Transfer (in press).

    J. A. Weibel, S. S. Kim, T. S. Fisher, and S. V. Garimella, "Carbon Nanotube Coatings for Enhanced Capillary-Fed Boiling from Porous Microstructures," Nanoscale and Microscale Thermophysical Engineering (in press).

    H. K. Dhavaleswarapu, J. Y. Murthy and S. V. Garimella, "Numerical Investigation of an Evaporating Meniscus in a Channel," International Journal of Heat and Mass Transfer (in press).

    S. R. Annapragada, J. Y. Murthy and S. V. Garimella, "Droplet Retention on an Incline," International Journal of Heat and Mass Transfer (in press).

    S. R. Annapragada, J. Y. Murthy and S. V. Garimella, "Prediction of Droplet Dynamics on an Incline," International Journal of Heat and Mass Transfer (in press).

    T. Chen and S. V. Garimella, "A Study of Critical Heat Flux during Flow Boiling in Microchannel Heat Sinks," ASME Journal of Heat Transfer (in press).

    K. K. Bodla, J. Y. Murthy, and S. V. Garimella, "Direct Simulation of Thermal Transport through Sintered Wick Microstructures," ASME Journal of Heat Transfer (in press).

    S. R. Annapragada, T. Salamon, P. Kolodner, M. Hodes and S. V. Garimella, "Determination of Electrical
    Contact Resistivity in Thermoelectric Modules (TEMS) from Module-Level Measurements," IEEE Transactions on Components, Packaging and Manufacturing Technology (in press).