Shubhra Bansal

Shubhra Bansal

Associate Professor of Mechanical Engineering and Materials Engineering

School of Mechanical Engineering
Purdue University
585 Purdue Mall
West Lafayette, IN 47907-2088
bansal91@purdue.edu

Office: FLEX 3081D

Phone: 7654943298

Research Interests

  • Renewable Energy Materials (physics-based energy yield predictions, sustainable PV and energy storage materials, recycling)
  • Electro-Optical-Thermo-Mechanical Reliability (in-situ and in-operando accelerated stress tests)
  • Heterogeneous Integration & Advanced Packaging (sub-10 μm pitch interconnects, low-loss interposers)
  • Harsh Environment Electronics Integration (high temperature Pb-free solders and nano-thermal interfaces)

Fundamental Research Area(s)

Application Area(s)

Awards and Recognitions

  • 2022 NASA Faculty Fellowship
  • 2021 NSF CAREER
  • 2020 UNLV Excellence in Teaching Award
  • 2014 DOE Technical Excellence Award
  • 2010 GE Patent Award, Six Sigma Black Belt
  • Multiple conference awards
  • PI and Co-PI on multiple DOE, NSF, DARPA, NASA winning proposals
  • 15+ patents awarded

Selected Publications

M. Jahandardoost, M. Nardone, T. M. Friedlmeier, C. Walkons, S. Bansal, "Heat- and Light-Soaking Behavior of RbF-Treated Cu(In,Ga)Se2 Solar Cells with Two Different Buffer Layers", J. Materials Research, 1-9, 2022. https://doi.org/10.1557/s43578-021-00472-3

J. V. Li, A. F. Halverson, O. V. Sulima, S. Bansal, J. M. Burst, T. M. Barnes, T. A. Gessert, D. H. Levi, "Effects of deep level, back contact, and absorber thickness on capacitance-voltage profiling of CdTe thin-film solar cells", Sol. Energy Mat. Sol. Cells, vol. 100, pp. 126, 2012. https://doi.org/10.1016/j.solmat.2012.01.003

H. Schoeller, S. Bansal, A Knobloch, D Shaddock, J Cho, "Effect of alloying elements on the creep behavior of high Pb-based solders", Materials Science and Engineering: A 528 (3), 1063-1070, 2011.

P. C. Millett, R. P. Selvam, S. Bansal, A. Saxena, "Atomistic simulation of grain boundary energetics - effects of dopants", Acta Mater., 2005, vol. 53, pp. 3671-3678. https://doi.org/10.1016/j.actamat.2005.04.031

R. Tummala, S. Bansal, P.M. Raj, "Fundamental limits of organic packages and boards and the need for novel ceramic boards for next generation electronic packaging", Journal of Electroceramics 13, 417-422, 2004. https://doi.org/10.1007/s10832-004-5135-6

S. Bansal, A. Saxena, R. R. Tummala, "Nanocrystalline copper and nickel as ultra high-density chip-to-package interconnections", 54th Electronic Components and Technology Conference Proceedings, pp. 1647-1651 Vol.2, 2004. https://doi.org/10.1109/ECTC.2004.1320336