Integrated, Scalable Design Prototyping Process to Improve the Specific Power Efficiency of Radars
Interdisciplinary Areas: | Defense related projects (for US citizens only) |
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Project Description
Interviews conducted with warfighters and Navy engineers revealed that radar systems requiring high powers, which result in high operating temperatures, create a pain point shared by many stakeholders. Because of the risk of radar overheating failures, power must be limited in current systems. Improved radar system efficiency would allow more comprehensive missions with fewer delays, thus saving lives through improved readiness. It is therefore vital to provide greater power efficiency to radar systems to reduce the peak dissipated power and operating temperature in radars to increase the mean time to failure (MTTF), particularly in unmanned aerial platforms. We will address this problem by developing a minimum viable product and prototype. The minimum viable product will be a radar package simulation tool, where the architecture, materials, and geometries can vary in the prediction of power added efficiency (PAE) and MTTF. The prototype will be a physical hardware package consisting of discrete power devices laid out in an array with spacing typical of a radar system to show both system scalability and the improvements in PAE and MTTF. We will also develop additional commercial partnerships to facilitate fabrication and testing of our advanced prototype designs, as well as longer-term reliability testing.
Start Date
May-June 2021
Postdoc Qualifications
Demonstrated ability to model thermal transport in complex 3D geometries across multiple length scales. Interest in modeling reliability of electronic components validated by experimental techniques, such as accelerated lifetime testing. Ability to design, fabricate, and test a prototype power electronic device operating at radio frequencies with active cooling. The ability to investigate the sources of electronic failures and to connect the results with the underlying theory.
Co-Advisors
Peter Bermel, Electrical & Computer Engineering. Email: pbermel@purdue.edu
Justin Weibel, Mechanical Engineering. Email: jaweibel@purdue.edu
References
Drummond, Kevin P., Doosan Back, Michael D. Sinanis, David B. Janes, Dimitrios Peroulis, Justin A. Weibel, and Suresh V. Garimella. "A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics." International Journal of Heat and Mass Transfer 117 (2018): 319-330.
Bermel, Peter. "Capturing Waste Heat with CMOS Microelectronics." Joule 4, no. 5 (2020): 982-983.
Noh, Jinhyun, Sami Alajlouni, Marko J. Tadjer, James C. Culbertson, Hagyoul Bae, Mengwei Si, Hong Zhou, Peter A. Bermel, Ali Shakouri, and D. Ye Peide. "High Performance Beta-Gallium Oxide Nano-Membrane Field Effect Transistors on a High Thermal Conductivity Diamond Substrate." IEEE Journal of the Electron Devices Society 7 (2019): 914-918.
Pan, Zhenhai, Justin A. Weibel, and Suresh V. Garimella. "Transport mechanisms during water droplet evaporation on heated substrates of different wettability." International Journal of Heat and Mass Transfer 152 (2020): 119524.