Mechanics and Thermodynamics of Heterogeneously Integrated Systems
Interdisciplinary Areas: | Micro-, Nano-, and Quantum Engineering |
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Project Description
For over 50 years, transistor scaling has enabled advancements in high performance computing, mobile devices, data centers, automotive and medical electronics, while ensuring 50% reductions in cost/transistor. However, significant challenge in scaling up system performance remains doubling transistor energy efficiency along with transistor scaling. As a result, the end of Moore’s Law is predicted to occur within the next ten years. Increasingly, the need for “More than Moore” heterogeneous integration of alongside “More Moore” traditional transistor scaling to achieve cost-effective Heterogeneously Integrated (HI) systems is becoming critical. Since HI systems are anticipated to be ubiquitous in future defense electronics, future generation HI systems will have to proactively address security and reliability issues that may be critical when the components to be integrated are sourced from diverse, potentially unverifiable sources. Thus, a critical need is to detect the failure of individual components and isolate failed components from others to enable at least partial functionality where possible may become a necessary part of the HI system design process. The mechanics and thermodynamics at small scale including solidification, diffusion, reaction, phase growth, fatigue and fracture are the individual scientific elements that will enable reliable, secure HI systems of the future.
Start Date
May 2020
Postdoc Qualifications
The ideal candidate would have a PhD degree in Mechanical Engineering or Materials Science with a strong foundation in solid mechanics with doctoral research experience in experimental characterization of mechanical behavior, fracture mechanics as well as thermodynamics of solidification and phase growth.
Co-advisors
Ganesh Subbarayan
ganeshs@purdue.edu
Mechanical Engineering
Carol Handwerker
carolh@purdue.edu
Materials Science and Engineering
References
P. Vaitheeswaran, A. Udupa, S. Sadasiva and G. Subbarayan, “Interface Balance Laws, Phase Growth and Nucleation Conditions for Multiphase Solids with Inhomogeneous Surface Stress.” Continuum Mechanics and Thermodynamics, doi: 10.1007/s00161-019-00804-z
A. Udupa, S. Sadasiva, and G. Subbarayan, “A Framework for Studying Dynamics and Stability of Diffusive-Reactive Interfaces with Application to Cu6Sn5 Intermetallic Compound Growth” Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences, vol. 472, issue 2190, no. 20160134, 2016, doi: 10.1098/rspa.2016.0134.
A. Tambat and G. Subbarayan, “Simulations of Arbitrary Crack Path Deflection at a Material Interface in Layered Structures.” Engineering Fracture Mechanics, vol. 141, pp. 124-139, 2015, doi: 10.1016/j.engfracmech.2015.04.034
D. Chan, G. Subbarayan, and L. Nguyen, “Maximum Entropy Principle for Modeling Damage and Fracture in Solder Joints: Enabling Life Predictions under Microstructural Uncertainty,” Invited Paper, Journal of Electronic Materials, vol. 41, no. 2, pp. 398-411, 2012, doi: 10.1007/s11664-011-1804-9.
A. Tambat, H-Y. Lin, G. Subbarayan, D.Y. Jung and B.G. Sammakia, “Simulations of damage, crack initiation and propagation in interlayer dielectric stacks: understanding assembly-induced fracture in dies,” Invited paper, special issue on 3D packaging, IEEE Transactions on Devices and Materials Reliability, vol. 12, no. 2, pp. 241-254, 2012, doi: 10.1109/TDMR.2012.2195006.