2005 Purdue–Silicon Valley Symposia
Integration of Novel Microelectronics Cooling Strategies Through Electrothermal Co-Design
Debilitating localized overheating problems in silicon chips, MEMS and integrated systems are likely to be resolved only by a multidisciplinary paradigm that brings together thermal, electrical, and materials engineering and other disciplines in an unprecedented approach.
The speaker and his colleagues have undertaken a combined multi-physics co-design research program, addressing thermal management in a range of chips and microsystems for computational, portable, telecommunications, and military applications. This effort coalesces around the development of an actual three-dimensional stacked chip structure, an ideal medium for exploring the practical implementation of knowledge and technologies developed through three research thrusts: thermally aware low-power devices and circuits; thermal management, sensing, and control; and design automation techniques. Hot-spot heat-removal rates exceeding 2000 W/cm 2 are targeted.
A number of techniques used in this work, which can address local areas of high-heat dissipation—including single- and two-phase flow in microscale channels, integrated micropumps, smart piezoelectric actuators, micro heat pipes, thermoelectrics, novel thermal nano-materials, and miniature refrigeration systems—will be summarized. Some of this work has been conducted under the framework of the speaker's National Science Foundation Compact, High-Performance Cooling Technologies Research Center ( www.ecn.purdue.edu/CTRC ).
Professor of Mechanical Engineering and Director, Cooling Technologies Research Center, Purdue University
Suresh Garimella previously held the Cray-Research Professorship at the University of Wisconsin-Milwaukee (UWM). He received his PhD (1989) from the University of California at Berkeley, his MS (1986) from The Ohio State University, and his BS (1985) from the Indian Institute of Technology, Madras. He is director of the NSF Cooling Technologies Research Center, the Electronics Cooling Laboratory, and the Solidification Heat Transfer Laboratory. His research interests include high-performance compact cooling technologies, electro-thermal co-design, electronics packaging, micro- and nano-scale thermal phenomena, and electronic and composite materials processing.
With more than 180 papers published in archival journals and conference proceedings, Professor Garimella and has also contributed to, and edited, several books. He serves as associate technical editor of ASME Journal of Heat Transfer , is on the board of editors of Experimental Heat Transfer , and has served as editor of Heat Transfer-Recent Contents and on the editorial board of Experimental Thermal and Fluid Science .
A fellow of the American Society of Mechanical Engineers (ASME), his efforts in research and engineering education have been recognized with the ASME Gustus L. Larson Memorial Award (2004), Graduate School/UWM Foundation Research Award (1995) for outstanding research and creative activity, UWM Distinguished Teaching Award (1997) for demonstrated dedication to excellence in undergraduate instruction, and Society of Automotive Engineers' Ralph R. Teetor Educational Award (1992).