msepostdoc-list Seminar Notice for Ziyun Huang's Preliminary Exam, Wednesday, Nov. 27, at 1:00, in ARMS 1021 " Thermodynamically-driven Massive Spalling in Solder Joints"

[Son, Rosemary E]

Please consider attending the following:

MATERIALS ENGINEERING
SEMINAR



"Thermodynamically-driven Massive Spalling in Solder Joints"


By
Ziyun Huang
Purdue MSE Preliminary Exam

Advisors: Professor Carol A. Handwerker and Professor John E. Blendell

ABSTRACT



Solder joint plays an important role in present packaging industry and has a great impact on overall reliability property of chips. This review will mainly focus on massive spalling phenomenon in solders and its thermodynamic driving force. The necessary condition for spalling to happen is that at least one of the active components has limited amount, and local equilibrium changes as the reactive constituent is consumed. Specifically, massive spalling results from two mechanism (1) grain boundary penetration and (2) microvoids aggregation. Both high-lead and lead-free solders will be considered due to environmental concern of lead. For each case, industrial methods to inhibit massive spalling have been discussed. However, increased interfacial energy as a consequence of spalling has never been directly proved, and more experiments are needed to further understand this problem.





Date: Wednesday, November 27, 2019

Time: 1:00 P.M.
Place: ARMS 1021
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