[BNC-grads-list] Job opening in Intel's Back-End Quality and Reliability Group

[Sunny Chugh]

Hi everyone,

My team at Intel has an opening for a full time position for a back-end quality and reliability engineer. If you or anyone you know is graduating within the next 5-6 months and are interested in applying, please let me know. Interested candidates can send their resume to me at sunny.chugh at intel.com<mailto:sunny.chugh at intel.com>. As the TD BE QnR group, my team is responsible for the definition, development and certification of Intel’s next generation processes against BE reliability risks and requires knowledge of device physics, fabrication process and data analysis/statistics.

Thanks
Sunny
Technology Development Quality and Reliability Engineer
Job Description

Join Intel and build a better tomorrow!

Quality and Reliability Engineering is a fast paced, dynamic environment requiring decision making at the strategic and tactical levels. The job requires a highly motivated self-starter with an ability to work with minimal supervision in a team environment. Close working relationships will be required with Intel's Technology Development groups (silicon, assembly and/or test), Manufacturing Quality and Reliability and the Product Divisions.

The impact of Q&R decisions on these groups makes the QRE position one of responsibility and high visibility. In this position, you may be responsible for Q&R assessments of Intel silicon, package and/or test technologies currently under development, or you may be responsible for identifying and developing materials characterization and failure analysis techniques in support of Intel's next generation process development.This is an entry level position and will be compensated accordingly.


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.


Minimum Qualifications:

-    Candidate must possess a Ph.D. degree in Electrical Engineering, Materials Science, Chemistry, Chemical Engineering, Physics or related field.

Preferred Qualifications:

- Experience in empirical data collection and statistical data analysis, reliability statistics, and design of experiments
-Knowledge of semiconductor fabrication, test and/or assembly packaging processing and associated materials.
-In-depth understanding of chemical structure characterization of inorganic as well as organic materials.
-Experience in one or more of the following areas: thin film process deposition and characterization, reaction kinetics, electrochemistry, semiconductor device physics, interconnect reliability.
-Hands-on experience in chemical analysis using equipment such as SIMS/TOFSIMS, XPS, EDX/EELS, XRF, GC/MS, LC/MS, IC, TDS, UV-Vis, SEM-EDS, TEM and FTIR/Raman.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

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