[Bnc-faculty-all-list] BNC recharge rates adjustment

[Weinstein, Dana]

Dear Birck PIs,

We recently performed an evaluation of recharge rates for Scifres (the Birck cleanroom), and will be rolling out the new rates on July 1. In order to assist with planning your budgets, we want to alert you to the modification in Scifres costs in advance of the roll-out.

This task should be performed at least every two years. However, this is the first such evaluation since 2012 and, as such, may come as a surprise to some PIs. Break-even rates for each tool are first calculated based on engineer time dedicated to the tool, cost of supplies, and usage. The final tool rate is then proposed based on these values, while ensuring that the facility does not make a profit. The average increase across the 104 tools/services in Scifres is 12%. The new rate is just 2.4% above the inflation rate from 2012. In all, 17 tools have seen a decrease in rate, while only a handful have increased substantially (e.g. CMP, CPD, Hall Effect system, a couple furnaces) due to dramatic change in usage or increased cost of maintenance due to aging. These rates are competitive with those of our peer facilities across the country. The proposed rates are attached for your reference.

In addition to these tools, we have various new capabilities recently available or coming up in the next few months (and in some cases weeks), which will add substantial capabilities to all users. Most new tools already have rates determined, while the most recent will be calculated and made available to users as they come.

o   Heidelberg MLA150 direct write lithography w/back side alignment, gray scale, high throughput (up and running)
o   Automatic developer/mask etcher/spin rinse for wafers, pieces, and reticles
o   FEI Apreo Cleanroom SEM
o   AJA ion mill with end point detection (finally up and running)
o   Plasma-Therm HDPCVD deposition tool with low temp high density film capability
o   RCA clean hood in furnace area (up and running)
o   Keyence digital microscope w/large depth of field and tilt capabilities (up and running)
o   2 RIE etchers for O2, Ar, CF4 (replacing the old Plasmatec, up and running)
o   IKO Jr. electroplating system w/2 interchangeable baths
o   Vacuum oven
o   Magnetic sputtering system

Finally, PIs should be aware of a modification to the Scifres cap model. The new cap policy is a bit more democratic and is aimed to encourage heavier user of the cleanroom by those who just miss the previous hard cap of 13k/yr. The new model is as follows:

Modified cap model:
A single user who accumulates expenses in excess of $10,000 but not more than $13,000 will have a soft cap applied (users pay 20% of normal rate). A single user who has expenses in excess of $13,000 will have a hard cap (no charge). Any user whose expenses exceed $28,000 will revert back to paying 100% of their charges.  In each of these scenarios, the charges incurred have to be for the same user on the same project and excludes the JEOL E-Beam Writer, staff time and expenses for precious metals and supplies. The exclusion of the JEOL ebeam lithography system from the cap reflects its disproportionate subsidy (due to the necessary service contract) and follows policy similar to that of comparable university fabs.


———————————————
Dana Weinstein
Associate Professor, Electrical and Computer Engineering
Associate Director of Operations, Birck Nanotechnology Center, Discovery Park
Purdue University
https://engineering.purdue.edu/hybridmems


-------------- next part --------------
A non-text attachment was scrubbed...
Name: BRK Rates Adjustment 2019.pdf
Type: application/pdf
Size: 58974 bytes
Desc: BRK Rates Adjustment 2019.pdf
URL: </ECN/mailman/archives/bnc-faculty-all-list/attachments/20190313/e71cc802/attachment-0001.pdf>