[Bnc-faculty-all-list] Fwd: ASME IMECE: Material Processing of Flexible Electronics, Sensors, and Devices

[Babak Ziaie]

FYI

---------- Forwarded message ----------
From: Aaron Mazzeo <aaron.mazzeo at rutgers.edu>
Date: Tue, Jul 17, 2018 at 9:55 PM
Subject: ASME IMECE: Material Processing of Flexible Electronics, Sensors,
and Devices
To: Babak Ziaie <bziaie at purdue.edu>


Babak,

We are organizing a topic for ASME IMECE on the "Material Processing of
Flexible Electronics, Sensors, and Devices".  The deadline to submit
abstracts for presentations is Monday, July 23rd, and the conference will
take place from November 12th to 15th in Pittsburgh, PA.  Please consider
submitting your own abstract or passing this message along to those who
might have an interest in participating.

This topic/symposium will cover experimental, design-related, and
mechanics-based efforts toward manufacturing or fabricating flexible
electronics, sensors, and devices.  Sessions might include but are not
limited to materials research or processing techniques related to the
following areas:

•    Modified conventional semiconductor-based processing for large-scale
flexible devices
•    Materials for biological/human-based monitoring of performance or
other factors
•    Contact printing/soft lithography and printed electronics
•    Additive manufacturing of 3D architected electronics
•    Design/fabrication of elastomeric actuators
•    Electroactive polymers
•    Transparent electronics
•    Novel stretchable or flexible substrates
•    Energy harvesting
•    Wearable devices
•    Skin-like sensors

To see this topic on the ASME 2018 IMECE website, you may follow this link
<http://www.asmeconferences.org/IMECE2018/TechnicalTracks.cfm>, click on
Materials: Genetics to Structures, and then click on Topic 11-8 Material
Processing of Flexible Electronics, Sensors, and Devices.  To submit an
abstract, you may follow this link
<http://www.asmeconferences.org/IMECE2018/Author/NewAbstract.cfm>.  We hope
to replicate and build on successes at IMECE 2014-2017 with multiple
sessions, productive discussions, and interactions.

We are grateful for the sponsorship of the Materials Processing Technical
Committee of the Materials Division, the Electronic Materials Technical
Committee of the Materials Division, and the Materials Processing and
Manufacturing Technical Committee of the Applied Mechanics Division.  If
you have any questions, please feel free to contact me by phone
(1-848-228-2498) or email <aaron.mazzeo at rutgers.edu>
<aaron.mazzeo at rutgers.edu>.  You may also contact the co-organizers listed
below.  Thank you for your time and consideration.

Aaron

Aaron Mazzeo (aaron.mazzeo at rutgers.edu), Department of Mechanical and
Aerospace Engineering, Rutgers University

Qiming Wang (qimingw at usc.edu), Department of Civil and Environmental
Engineering, University of Southern California

Jianliang Xiao (Jianliang.Xiao at colorado.edu), Department of Mechanical
Engineering, University of Colorado

W. Hong Yeo (whyeo at gatech.edu), Woodruff School of Mechanical Engineering,
Georgia Institute of Technology

Cunjiang Yu (cyu13 at central.uh.edu), Department of Mechanical Engineering,
University of Houston

Yuris Dzenis (ydzenis at unl.edu), Department of Mechanical and Materials
Engineering, University of Nebraska at Lincoln
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