[BNC-all] 2024 Symposium on Reliability for Electronics and Photonics Packaging (program schedule pdf attached)

[Wei, Tiwei]

The 2024 Symposium on Reliability for Electronics and Photonics Packaging (REPP) will take place on November 7-8, 2024, at Purdue University, BRK 1001,  in West Lafayette, Indiana, USA. This year's symposium will feature four special sessions focused on reliability:
(1) Reliability for Thermal, Mechanical, and Cooling Systems
(2) Reliability for Analog/RF and Power Integrated Circuits
(3) Reliability for Photonics
(4) Reliability and Metrology for Advanced Packaging and 3D Interconnects in AI and HPC
IEEE REPP-2024 will be a hybrid event, offering both in-person and virtual participation via WebEx. For more details, please visit our REPP website: https://lnkd.in/gj3DTigA<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Flnkd.in%2Fgj3DTigA&data=05%7C02%7Cbnc-all%40ecn.purdue.edu%7C532c3fadf8dc4cafddce08dcf61fbc9c%7C4130bd397c53419cb1e58758d6d63f21%7C0%7C0%7C638655863676552763%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C0%7C%7C%7C&sdata=atmdxqWLT3CbwQihayonP%2FyNdKprxUhi%2Bk1zchs4VH0%3D&reserved=0>. To register, use the following link: https://lnkd.in/gS8u6PtU<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Flnkd.in%2FgS8u6PtU&data=05%7C02%7Cbnc-all%40ecn.purdue.edu%7C532c3fadf8dc4cafddce08dcf61fbc9c%7C4130bd397c53419cb1e58758d6d63f21%7C0%7C0%7C638655863676552763%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C0%7C%7C%7C&sdata=JjQx4mZb4sNq1EjzcVwB%2F0vvyJ7Nm0yXaklOQKWJkVE%3D&reserved=0>. We look forward to seeing you at REPP 2024!

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