[BNC-all] 2024 Symposium on Reliability for Electronics and Photonics Packaging (program schedule pdf attached)

[Wei, Tiwei]

Dear all,

The final symposium program schedule is attached in this calendar invitation. Looking forward to seeing you all next week.

The 2024 Symposium on Reliability for Electronics and Photonics Packaging (REPP) will take place on November 7-8, 2024, at Purdue University, BRK 1001,  in West Lafayette, Indiana, USA. This year's symposium will feature four special sessions focused on reliability:
(1) Reliability for Thermal, Mechanical, and Cooling Systems
(2) Reliability for Analog/RF and Power Integrated Circuits
(3) Reliability for Photonics
(4) Reliability and Metrology for Advanced Packaging and 3D Interconnects in AI and HPC
IEEE REPP-2024 will be a hybrid event, offering both in-person and virtual participation via WebEx. For more details, please visit our REPP website: https://lnkd.in/gj3DTigA<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Flnkd.in%2Fgj3DTigA&data=05%7C02%7Cbnc-all%40ecn.purdue.edu%7Ca58ccbd2cba04c35f0bb08dcfae3f6a2%7C4130bd397c53419cb1e58758d6d63f21%7C0%7C0%7C638661105259932965%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C0%7C%7C%7C&sdata=V3o%2FRiKigckPf9vt02mSaeOT%2B0ikLnCYt4GZ0qtCVZw%3D&reserved=0>. To register, use the following link: https://lnkd.in/gS8u6PtU<https://nam04.safelinks.protection.outlook.com/?url=https%3A%2F%2Flnkd.in%2FgS8u6PtU&data=05%7C02%7Cbnc-all%40ecn.purdue.edu%7Ca58ccbd2cba04c35f0bb08dcfae3f6a2%7C4130bd397c53419cb1e58758d6d63f21%7C0%7C0%7C638661105259932965%7CUnknown%7CTWFpbGZsb3d8eyJWIjoiMC4wLjAwMDAiLCJQIjoiV2luMzIiLCJBTiI6Ik1haWwiLCJXVCI6Mn0%3D%7C0%7C%7C%7C&sdata=RA9Dzfkm0WNjJy9L%2Bn9taVWwPWHWsdSO%2BvhRIxXLvgg%3D&reserved=0>. We look forward to seeing you at REPP 2024!

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