Achieving Power Integrity through Systematic Design
|Event Date:||March 27, 2015|
|Speaker:||J. L. Drewniak|
|Speaker Affiliation:||Missouri S&T EMC Laboratory
|Contact Name:||Professor Dan Jiao
Channels in emerging high data-rate systems have a jitter budget that is on the order of 10 ps, and power integrity (PI) is among the significant challenges impacting jitter. The usual design approach for a power distribution network (PDN) at the package and PCB levels follows best engineering practices, and, mature commercial CAD tools are available for post-layout design analysis. However, there are no proven, quantitative methodologies for developing a PDN design to meet voltage ripple and droop requirements, and design specifications are typically met through a trial-and-error process of best practices and CAD tools. A methodology has been developed for PDN design and PI analysis that can readily identify a best design for the package and PCB given typical design constraints such as BGA pitch, package stackup, package with or without decoupling, PCB stackup, and signal routing egress and ingress, among others. A method for computation and physics-based circuit extraction has been developed that is used to calculate the PDN impedance and to assess worst case voltage ripple on the PDN. If the target impedance specification is not met, the developed methodology and approach can be used to immediately
identify if specifications can be achieved with design modifications within the constraints, and exactly how to do so without numerous trial-and-error simulations. The underlying physics for power integrity design will be presented and a physics-based design approach shown.
James L. Drewniak is a Curator’s Professor of Electrical and Computer Engineering at Missouri S&T, and with the Electromagnetic Compatibility Laboratory. He received B.S., M.S., and Ph.D. degrees in electrical engineering from the University of Illinois at Urbana-Champaign. His research is in electromagnetic compatibility, signal and power integrity, and electronic packaging. He leads a university laboratory of over 60 people that is internationally recognized for research in EMC and signal and power integrity, with funding that has included the NSF, DoD, DOE, as well as industry. A key research funding component is the NSF Industry/University Cooperative Research Center (I/UCRC) for Electromagnetic Compatibility that is a consortium of approximately 20 companies and over 20 funded projects. He is a Fellow of the IEEE, 2013 recipient of the IEEE EMC Society’s Richard R. Stoddart Award, a current EMC Society Distinguished Lecturer, and a past Associate Editor of the IEEE Transactions on EMC.