System on Package
|Event Date:||March 20, 2008|
|Speaker:||Professor Madhavan Swaminathan|
|Speaker Affiliation:||Georgia Institute of Technology|
|Contact Name:||Prof Byunghoo Jung
|Open To:||ACCEPTABLE FOR ECE694A
As the semiconductor industry moves beyond the 45nm node and as systems become more mixed signal in nature, System on Chip (SoC) solutions are facing major barriers due to technical and business related reasons. This is leading to the development of alternate technological solutions such as System on Package (SoP). SoP, a technology being pioneered by Georgia Tech, allows for integration of functions in the substrate. Higher levels of integration are being achieved by embedding functions in the package and merging the package and board. In this presentation aspects of RF and digital integration will be discussed in the context of System on Package implementation.
Madhavan Swaminathan is the Joseph M. Pettit Professor in Electronics in the School of Electrical and Computer Engineering and Deputy Director of the Packaging Research Center, Georgia Tech. He is the co-founder of Jacket Micro Devices, a company specializing in RF substrates and modules for WLAN and WiMAX applications. He has over 300 publications in refereed journals and conferences, 15 patents and is the author and co-author of two books “Power Integrity Modeling and Design for Semiconductors and Systems”, Prentice Hall, 2007 and “Introduction to SOP”, McGraw Hill, 2008. Prior to joining Georgia Tech, he was with IBM working on the packaging for supercomputers. Madhavan is a Fellow of IEEE and is one of the pioneers of SOP technology at Georgia Tech.